TSM-147-04-LM-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-147-04-LM-DV-P-TR is a 94-position dual-row surface mount terminal strip with .100" pitch. Features low-profile design and tape-and-reel packaging for automated assembly. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TSM-147-04-LM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 94-position dual-row configuration with .100" (2.54 mm) pitch for high-density board interconnects
- Surface mount terminal strip format enables low-profile, automated PCB assembly with tape-and-reel packaging
- Dual-row layout maximizes signal density while maintaining .100" standard pitch compatibility
Applications
The TSM-147-04-LM-DV-P-TR is well-suited for backplane and board-to-board interconnect applications requiring high pin-count dual-row connectivity. Its surface mount design makes it ideal for compact industrial control systems, telecommunications equipment, and test instrumentation PCBs where space efficiency is critical.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and row configuration of the TSM-147-04-LM-DV-P-TR?
The TSM-147-04-LM-DV-P-TR features a .100" (2.54 mm) pitch dual-row layout with 94 total positions, providing a high-density surface mount terminal strip solution suitable for demanding interconnect applications requiring many signal connections in a compact PCB footprint.
Which PCB assembly methods are compatible with the TSM-147-04-LM-DV-P-TR?
This part supports surface mount technology (SMT) assembly and is supplied in tape-and-reel (TR) packaging, making it compatible with automated pick-and-place machines. The SMT format with 94 pins on a .100" pitch grid allows high-throughput reflow soldering in production environments.
When is the TSM-147-04-LM-DV-P-TR preferred over through-hole terminal strips?
The TSM-147-04-LM-DV-P-TR is preferred when PCB thickness constraints or double-sided assembly requirements rule out through-hole components. Its surface mount profile keeps board height to a minimum, and the 94-position dual-row format delivers the same signal count as through-hole alternatives while enabling fully automated SMT assembly lines.
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