TSM-145-04-H-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-145-04-H-DV-P-TR is a 90-position dual-row surface mount terminal strip with 0.100" pitch, offering reliable high-density PCB connectivity. Features gold-plated contacts and SMT mounting for compact board layouts. Available from stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TSM-145-04-H-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 90-position dual-row configuration with 0.100" (2.54 mm) pitch for high-density SMT interconnects
- Gold-plated contacts ensure low contact resistance and long-term reliability in demanding environments
- Tape-and-reel packaging (-TR suffix) supports automated pick-and-place assembly for high-volume production
Applications
The TSM-145-04-H-DV-P-TR is well suited for backplane and mezzanine board-to-board connections in industrial control systems and test equipment. Its 90-position dual-row layout makes it ideal for high-density signal routing in embedded computing modules and data acquisition hardware. The SMT footprint enables compact PCB designs used in communications infrastructure and scientific instrumentation.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch and row configuration of the TSM-145-04-H-DV-P-TR?
The TSM-145-04-H-DV-P-TR uses a 0.100" (2.54 mm) pitch dual-row layout with 90 total positions (45 per row), providing a high-density SMT footprint suitable for compact PCB designs requiring many signal connections in a small area.
Which board-to-board applications benefit most from the dual-row 90-position design of this SAMTEC terminal strip?
Backplane interconnects, mezzanine card stacking, and embedded computing modules benefit most from the 90-position dual-row design. The 0.100" pitch and SMT mounting allow designers to route up to 90 signals across two rows while keeping the PCB footprint under 4.6" in total contact span.
How does the tape-and-reel (-TR) packaging of TSM-145-04-H-DV-P-TR support high-volume PCB assembly?
The -TR suffix indicates tape-and-reel packaging compatible with standard pick-and-place machines, enabling automated SMT placement at rates exceeding 1,000 parts per hour. This reduces manual handling errors and supports IPC-A-610 Class 2 or Class 3 assembly processes for high-volume production runs.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”