TSM-145-03-STL-DV-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-145-03-STL-DV-P-TR is a 90-position dual-row surface-mount terminal strip at 0.100 inch (2.54 mm) pitch with a straddle-mount low-profile configuration. Supplied on tape-and-reel for automated SMT pick-and-place manufacturing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 90
- Lifecycle
- ACTIVE
- Datasheet
- TSM-145-03-STL-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 90-position dual-row terminal strip at 0.100 inch (2.54 mm) pitch provides one of the highest contact counts in the TSM series, covering wide parallel buses and multi-channel I/O interfaces in a single connector
- Straddle-mount low-profile (STL) configuration mounts across the PCB edge, enabling direct board-edge interconnect without additional mating hardware
- Surface-mount termination with tape-and-reel (TR) packaging supports fully automated SMT reflow assembly for high-volume production efficiency
- SAMTEC precision manufacturing delivers consistent contact geometry across all 90 positions, ensuring reliable mating with dual-row headers and minimizing impedance variation on parallel data buses
Applications
The TSM-145-03-STL-DV-P-TR is designed for high-density board-edge or board-to-board interconnects in FPGA development kits, embedded computing backplanes, and industrial I/O expansion modules where 90 signals must pass through a single connector at 0.100 inch pitch. Its straddle-mount configuration is especially useful in card-edge or mezzanine applications where the connector straddles the PCB substrate, reducing overall assembly height compared to standard upright terminal strips. Tape-and-reel packaging enables efficient automated placement in high-volume manufacturing of data acquisition systems, motor controllers, and programmable logic platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does TSM-145-03-STL-DV-P-TR provide and what does the STL designator indicate about its mounting style?
The TSM-145-03-STL-DV-P-TR offers 90 positions in a dual-row layout at 0.100 inch (2.54 mm) pitch, with STL indicating a straddle-mount low-profile configuration where the connector body straddles the PCB edge rather than sitting upright on one side. This approach reduces the vertical profile above the PCB surface and enables direct card-edge interconnect without a separate edge-launch mating connector, simplifying the mechanical design in backplane and mezzanine module applications.
Which types of parallel bus or I/O applications benefit from the 90-position count of TSM-145-03-STL-DV-P-TR?
Applications requiring 64-bit or wider parallel data buses, plus address, control, power, and ground signals, benefit directly from the 90-position count of TSM-145-03-STL-DV-P-TR because all lines fit through a single connector, eliminating the need for two or more connectors that would increase board area and connector count. FPGA breakout boards, high-channel-count ADC/DAC modules, and multi-axis motor controller cards commonly use 90-pin dual-row configurations at 0.100 inch pitch to route a complete interface in one compact strip.
What is the row arrangement of TSM-145-03-STL-DV-P-TR and how does dual-row compare to single-row at the same pitch?
The TSM-145-03-STL-DV-P-TR arranges its 90 contacts in 2 rows of 45 contacts each at 0.100 inch (2.54 mm) pitch, occupying roughly 4.5 inches of connector length on the PCB. A single-row connector at the same 0.100 inch pitch would need to be 9 inches long to provide 90 positions, doubling the PCB edge real estate required. The dual-row format is therefore essential in compact board designs where PCB edge length is a constraint.
How is TSM-145-03-STL-DV-P-TR packaged for production, and which assembly process does it support?
The connector ships in tape-and-reel (TR) packaging that feeds directly into automated pick-and-place machines without manual de-reeling, enabling consistent placement accuracy across 90-position parts at high throughput. It is designed for surface-mount reflow soldering, compatible with standard lead-free SAC305 profiles peaking at 260 °C per J-STD-020, making it suitable for modern RoHS-compliant PCB assembly lines in industrial and commercial electronics manufacturing.
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