TSM-141-04-L-DV-P-TR SAMTEC Connector (Other) In Stock
The TSM-141-04-L-DV-P-TR is an 82-position dual-row 0.100-inch pitch surface-mount terminal strip from SAMTEC, offering reliable board-to-board connectivity with tin-plated contacts. It supports standard 2.54 mm pitch spacing compatible with common headers and backplanes. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TSM-141-04-L-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row layout at 0.100-inch (2.54 mm) pitch maximizes pin density on standard SMT footprints
- Surface-mount termination simplifies PCB assembly with reflow soldering compatibility
- Tape-and-reel packaging (TR suffix) enables high-volume automated pick-and-place assembly
Applications
The TSM-141-04-L-DV-P-TR is used in backplane interconnect systems, industrial control boards, and test-and-measurement equipment where a high-density 82-position dual-row header is required on a 0.100-inch pitch. Its surface-mount design suits automated PCB assembly lines producing telecommunications and computing hardware.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-141-04-L-DV-P-TR provide and what is its pin pitch?
The TSM-141-04-L-DV-P-TR offers 82 positions arranged in a dual-row configuration on a 0.100-inch (2.54 mm) pitch. This standard pitch ensures compatibility with a wide range of mating headers and backplane connectors commonly used in industrial and computing PCB designs.
What assembly method does the TSM-141-04-L-DV-P-TR support for high-volume production?
The connector uses surface-mount termination, making it compatible with standard SMT reflow soldering processes. The TR suffix indicates tape-and-reel packaging, which supports automated pick-and-place equipment for high-volume PCB assembly, reducing labor costs and placement errors.
In which backplane or board-stacking applications is the TSM-141-04-L-DV-P-TR typically deployed?
This 82-pin dual-row terminal strip is well-suited for backplane interconnects in telecommunications chassis, industrial PLC racks, and modular test equipment. Its 0.100-inch pitch and SMT footprint allow dense signal routing between daughter cards and mother boards in standard 2.54 mm grid layouts.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”