TSM-110-01-L-DV-P SAMTEC Connector (Other) In Stock

Name: TSM-110-01-L-DV-P
Brand: SAMTEC
SKU: TSM-110-01-L-DV-P
Availability: InStock

SAMTEC TSM-110-01-L-DV-P is a 20-position dual-row 2.54 mm pitch through-hole receptacle connector with gold over nickel contact finish (10 µin gold mating surface) and RoHS-compliant construction, designed for reliable board-to-board and card-edge signal connections. Available worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026

Package / Visual Reference

TSM-110-01-L-DV-POther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 20
Lifecycle: ACTIVE
Datasheet: TSM-110-01-L-DV-P Datasheet PDF
Category: Connector
Price: From $0.7774(MOQ 3)
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of TSM-110-01-L-DV-P?

20-position dual-row receptacle with 2.54 mm pitch and 10 µin gold over 50 µin nickel mating contact finish for reliable low-resistance signal connections
RoHS-compliant through-hole construction with tin-over-nickel termination finish supports standard lead-free wave soldering assembly
1-week factory lead time with E.L.P. (Extended Life Products) designation ensuring long-term supply availability for industrial and instrumentation designs

What is TSM-110-01-L-DV-P used for?

The TSM-110-01-L-DV-P is used in board-to-board and daughter-card connector applications where a 20-position dual-row 2.54 mm pitch through-hole receptacle is required, such as in test and measurement systems, industrial control panels, and development boards. Its gold-plated mating contacts and RoHS-compliant construction suit applications requiring reliable multi-cycle connectivity and compliance with environmental regulations in telecommunications and embedded computing equipment.

What are the specifications of TSM-110-01-L-DV-P?

Pbfree Code	Yes
Factory Lead Time	1Week
YTEOL	9.1
Additional Feature	E.L.P.
Body Breadth	0.2inch
Body Length	1inch
Body/Shell Style	RECEPTACLE
Connector Type	BOARD CONNECTOR
Contact Finish Mating	GOLD (10) OVER NICKEL (50)
Contact Finish Termination	Tin (Sn) - with Nickel (Ni) barrier
Contact Gender	MALE
Contact Material	PHOSPHOR BRONZE
Contact Pattern	RECTANGULAR
Contact Style	SQ PIN-SKT
DIN Conformance	NO
Filter Feature	NO
IEC Conformance	NO
Insulator Color	BLACK
Insulator Material	LIQUID CRYSTAL POLYMER
JESD-609 Code	e3
MIL Conformance	NO
Mating Contact Pitch	0.1inch
Mating Contact Row Spacing	0.1inch
Mating Information	MULTIPLE MATING PARTS AVAILABLE
Mixed Contacts	NO
Mounting Option 1	LOCKING
Mounting Style	STRAIGHT
Mounting Type	BOARD
Number Of Connectors	ONE
Number Of PCB Rows	2
Number of Rows Loaded	2
Option	GENERAL PURPOSE
PCB Contact Pattern	RECTANGULAR
Plating Thickness	10u inch
Rated Current (Signal)	7A
Reference Standard	UL
Terminal Pitch	2.54mm
Termination Type	SURFACE MOUNT
Total Number of Contacts	20
Package	Other

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
ECCN	EAR99
HTS Code	8536.69.40.40
Country of Origin	Malaysia, Vietnam

Where can I find the TSM-110-01-L-DV-P datasheet?

TSM-110-01-L-DV-P Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TSM-110-01-L-DV-P?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact finish does the TSM-110-01-L-DV-P use, and why does it matter for reliability?

The TSM-110-01-L-DV-P uses 10 µin (0.25 µm) gold over 50 µin (1.27 µm) nickel as the mating contact finish, and tin over nickel on the termination ends. The gold mating surface minimizes contact resistance and resists oxidation over hundreds of mating cycles, which is critical for reliable signal integrity in test fixtures, development boards, and instruments that undergo frequent connector insertion and removal.

How many positions and what pitch does the TSM-110-01-L-DV-P connector provide?

The TSM-110-01-L-DV-P is a 20-position dual-row through-hole receptacle with a standard 2.54 mm (0.1 inch) pitch and a 1-inch body length. The dual-row configuration fits 10 contacts per row, making it compatible with 2x10 pin header arrays commonly used for GPIO expansion, peripheral interfacing, and debug connectors in embedded system designs.

When is the TSM-110-01-L-DV-P preferable over surface mount receptacles for a board interconnect design?

The through-hole construction of the TSM-110-01-L-DV-P provides superior mechanical retention compared to SMD receptacles, making it the preferred choice in applications exposed to vibration, repeated mating, or physical stress such as industrial control panels, test jigs, and field-replaceable I/O boards. Its 2.54 mm pitch and standard 20-position layout also allow manual soldering and repair, unlike fine-pitch SMD connectors that require reflow oven or hot-air rework.

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AvailabilityIn Stock

Reference Price (USD)

From $0.7774

Buy from 1pc · Factory-direct pricing

Qty.	Unit Price	Ext. Price
3+	$3.6793	$11.04
22+	$1.7980	$39.56
1012+	$1.6900	$1710.28
2000+	$1.1928	$2385.54
5000+	$0.9748	$4874.25
10000+	$0.7774	$7773.80

pcs

Unit price: $3.6793 · Total: $11.04

In Stock · 24h Response · Worldwide Shipping

Direct Contact

WhatsApp Inquiry Email RFQ

Lead Time3-7 business days

MOQFrom 1 piece

ShippingDHL / FedEx / UPS

OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”

James Wright

Supply Chain Director, CircuitPro Ltd, UK

TSM-110-01-L-DV-P SAMTEC Connector (Other) In Stock

What are the key features of TSM-110-01-L-DV-P?

What is TSM-110-01-L-DV-P used for?

What are the specifications of TSM-110-01-L-DV-P?

Compliance & Regulatory

Where can I find the TSM-110-01-L-DV-P datasheet?

What are equivalent replacements for TSM-110-01-L-DV-P?

Frequently Asked Questions

What contact finish does the TSM-110-01-L-DV-P use, and why does it matter for reliability?

How many positions and what pitch does the TSM-110-01-L-DV-P connector provide?

When is the TSM-110-01-L-DV-P preferable over surface mount receptacles for a board interconnect design?

Related Guides

STM32H753VIT6 High-Performance MCU Design Guide

STM32H753ZIT6 Selection Guide for High-Performance Embedded Systems

ICL7660ACPAZ Negative Voltage Charge Pump Design Guide

C0402C103K3RACTU 10 nF MLCC Design Guide

Why Buy from FindMyChip

About SAMTEC

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