TSM-110-01-L-DV-P SAMTEC Connector (Other) In Stock
SAMTEC TSM-110-01-L-DV-P is a 20-position dual-row 2.54 mm pitch through-hole receptacle connector with gold over nickel contact finish (10 µin gold mating surface) and RoHS-compliant construction, designed for reliable board-to-board and card-edge signal connections. Available worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 20
- Lifecycle
- ACTIVE
- Datasheet
- TSM-110-01-L-DV-P Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row receptacle with 2.54 mm pitch and 10 µin gold over 50 µin nickel mating contact finish for reliable low-resistance signal connections
- RoHS-compliant through-hole construction with tin-over-nickel termination finish supports standard lead-free wave soldering assembly
- 1-week factory lead time with E.L.P. (Extended Life Products) designation ensuring long-term supply availability for industrial and instrumentation designs
Applications
The TSM-110-01-L-DV-P is used in board-to-board and daughter-card connector applications where a 20-position dual-row 2.54 mm pitch through-hole receptacle is required, such as in test and measurement systems, industrial control panels, and development boards. Its gold-plated mating contacts and RoHS-compliant construction suit applications requiring reliable multi-cycle connectivity and compliance with environmental regulations in telecommunications and embedded computing equipment.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.1 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.2inch |
| Body Length | 1inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (10) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| Plating Thickness | 10u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 20 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TSM-110-01-L-DV-P use, and why does it matter for reliability?
The TSM-110-01-L-DV-P uses 10 µin (0.25 µm) gold over 50 µin (1.27 µm) nickel as the mating contact finish, and tin over nickel on the termination ends. The gold mating surface minimizes contact resistance and resists oxidation over hundreds of mating cycles, which is critical for reliable signal integrity in test fixtures, development boards, and instruments that undergo frequent connector insertion and removal.
How many positions and what pitch does the TSM-110-01-L-DV-P connector provide?
The TSM-110-01-L-DV-P is a 20-position dual-row through-hole receptacle with a standard 2.54 mm (0.1 inch) pitch and a 1-inch body length. The dual-row configuration fits 10 contacts per row, making it compatible with 2x10 pin header arrays commonly used for GPIO expansion, peripheral interfacing, and debug connectors in embedded system designs.
When is the TSM-110-01-L-DV-P preferable over surface mount receptacles for a board interconnect design?
The through-hole construction of the TSM-110-01-L-DV-P provides superior mechanical retention compared to SMD receptacles, making it the preferred choice in applications exposed to vibration, repeated mating, or physical stress such as industrial control panels, test jigs, and field-replaceable I/O boards. Its 2.54 mm pitch and standard 20-position layout also allow manual soldering and repair, unlike fine-pitch SMD connectors that require reflow oven or hot-air rework.
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