TSM-106-01-S-SV SAMTEC Connector (Header, Unshrouded - Single Row Staggered SMD Pin) In Stock
SAMTEC TSM-106-01-S-SV is a 6-position single-row staggered SMD pin header with 0.100 inch pitch, featuring 30 microinch gold over nickel mating contacts and E.L.P. (Extended Life Performance) plating for superior reliability. Compact RoHS-compliant board connector designed for SMT assembly with fast 1-week lead time. Available in stock worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Header, Unshrouded - Single Row Staggered SMD Pin
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-106-01-S-SV Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6-position single-row SMD staggered pin header at 0.100 inch (2.54 mm) pitch for standard-density board connections
- 30 microinch gold over 50 microinch nickel mating contact finish provides Extended Life Performance (E.L.P.) and low contact resistance
- Staggered SMD pin configuration improves solder joint strength and PCB pull-off resistance versus standard straight SMT tails
- RoHS-compliant matte tin-over-nickel termination finish compatible with lead-free SAC305 reflow soldering processes
Applications
The TSM-106-01-S-SV is used in compact board-to-board and wire-to-board signal interconnect applications in consumer electronics, industrial sensors, and embedded computing modules requiring a reliable 6-pin SMT header. The E.L.P. gold contact finish ensures consistent low-resistance connections over thousands of mating cycles, making it suitable for frequently accessed debug, programming, or expansion headers. Its compact 0.6 x 0.15 inch body fits within tight PCB layouts where standard through-hole headers cannot be accommodated.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.1inch |
| Body Depth | 0.15inch |
| Body Length | 0.6inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | STAGGERED |
| PCB Contact Row Spacing | 3.175mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 5.08mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 6 |
| UL Flammability Code | 94V-0 |
| Package | Header, Unshrouded - Single Row Staggered SMD Pin |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TSM-106-01-S-SV:
suggested
suggested
suggested
Frequently Asked Questions
What does the E.L.P. (Extended Life Performance) contact finish mean for the TSM-106-01-S-SV in high-cycle applications?
E.L.P. refers to the 30 microinch gold over 50 microinch nickel contact finish on the mating surface of the TSM-106-01-S-SV, which provides a thicker gold layer than standard 15 microinch finishes. This extended gold thickness maintains contact resistance below 20 milliohms across 500 to 1000 mating cycles, making the 6-position header reliable for frequently reconnected debug probes, programming jigs, and removable expansion modules in industrial and test equipment.
How does the staggered SMD pin design of the TSM-106-01-S-SV improve PCB attachment strength compared to straight SMT tails?
The staggered pin arrangement offsets alternate pins by 0.05 inch in the soldering tail, distributing solder joint stress across a wider PCB pad pattern and increasing the mechanical pull-off force by approximately 30% compared to inline SMT tails. For the 6-position TSM-106-01-S-SV, this means the connector can withstand cable pull and mating forces in portable or handheld devices without detaching from the PCB pads at soldering temperatures up to 260°C.
What is the typical PCB footprint required for the TSM-106-01-S-SV in an SMT layout?
The TSM-106-01-S-SV has a body length of 0.6 inch, body depth of 0.15 inch, and body breadth of 0.1 inch. The staggered SMD pad pattern spans approximately 0.65 inch by 0.25 inch including the solder tail extensions, and designers should allow a courtyard clearance of at least 0.5 mm around this envelope for component placement in dense PCB designs at 0.100 inch pitch.
Is the TSM-106-01-S-SV suitable as a programming header for microcontroller boards that use JTAG or SWD interfaces?
Yes, the TSM-106-01-S-SV is well suited for 6-pin JTAG or SWD programming interfaces, as these protocols typically require 4 to 6 signal pins including SWDIO, SWDCLK, ground, and power signals operating at 3.3 V or 5 V logic levels. The gold E.L.P. contacts handle the repeated insertion of programming cables across hundreds of development cycles, and the 1-week factory lead time ensures fast procurement for prototype batches.
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