TSM-104-01-T-DH-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TSM-104-01-T-DH-A-P-TR is a 4-position dual-height board connector with 0.100 inch pitch, matte tin contact finish, and peg board mounting. It features dual-height stackable design with E.L.P. (Extended Life Plating) contacts for reliable signal connections. Available RoHS compliant in tape-and-reel packaging with worldwide distribution.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TSM-104-01-T-DH-A-P-TR Datasheet PDF
- Category
- Connector
- Price
- From $0.8036(MOQ 79)
- Temp Range
- -55.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-height (DH) stackable design at 0.100 inch pitch enables flexible board-to-board stacking heights for modular embedded system configurations
- E.L.P. (Extended Life Plating) with matte tin contact finish provides enhanced durability over standard tin plating, supporting 500+ mating cycles in industrial environments
- Integrated PEG board mounting option improves mechanical stability during soldering and in-service vibration for rugged PCB assemblies
Applications
The TSM-104-01-T-DH-A-P-TR is designed for compact board-to-board stacking applications in embedded computing, industrial control modules, and portable instrumentation. Its 4-position dual-height configuration suits low-pin-count signal headers connecting daughtercards to baseboards in 0.100 inch pitch standard grid systems. Engineers deploy it in development kits, sensor interface boards, and prototyping platforms where secure, removable board-to-board connections are required.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 4 Weeks, 1 Day |
| YTEOL | 9.1 |
| Additional Feature | E.L.P. |
| Board Mounting Option | PEG |
| Body Breadth | 0.24inch |
| Body Depth | 0.41inch |
| Body Length | 0.4inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | MATTE TIN |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Contact Row Spacing | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.191mm |
| Rated Current (Signal) | 7A |
| Terminal Pitch | 2.54mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 8 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What does the dual-height (DH) designation mean for the TSM-104-01-T-DH-A-P-TR?
Dual-height means the connector accommodates two different stacking heights, allowing engineers to select the board separation that fits their mechanical envelope. The TSM-104 series at 0.100 inch pitch provides stacking configurations typically ranging from 8.6 mm to 15.2 mm board-to-board spacing, supporting designs that require accessible inter-board clearance for components mounted on the lower board.
How does E.L.P. contact plating benefit designs with frequent board mating cycles?
E.L.P. (Extended Life Plating) applies a thicker, more wear-resistant tin finish over the 4 contacts compared to standard electroplated tin, supporting reliable connectivity through 500 or more mating cycles. This is critical for prototyping and test fixtures where boards are assembled and disassembled repeatedly, maintaining contact resistance below 20 milliohms throughout the connector's service life.
Why use a 4-position PEG-mounted connector rather than a surface-mount alternative for small signal headers?
The PEG (through-hole peg) mounting on the TSM-104-01-T-DH-A-P-TR provides mechanical anchoring at the 0.41 inch body depth during reflow soldering, preventing connector rotation or floating that can misalign the 4 contact pins. This is essential on boards subject to vibration in industrial automation equipment, where a surface-mount-only connector at 0.100 inch pitch could crack solder joints under repeated mechanical stress.
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About SAMTEC
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 79+ | $1.3000 | $102.70 |
| 200+ | $1.2530 | $250.60 |
| 316+ | $1.1700 | $369.72 |
| 500+ | $1.1000 | $550.00 |
| 1000+ | $0.9810 | $981.00 |
| 2000+ | $0.8036 | $1607.22 |
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