TSM-104-01-S-SV SAMTEC Connector (Header, Unshrouded - Single Row Staggered SMD Pin) In Stock
SAMTEC TSM-104-01-S-SV is a 4-position single-row staggered SMD receptacle header with 2.54 mm (0.1") pitch, featuring 30 µin gold over 50 µin nickel contact finish for reliable low-resistance mating. It supports Easy-Latch-Probe (ELP) access and RoHS-compliant construction. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Unshrouded - Single Row Staggered SMD Pin
- Pin Count
- 4
- Lifecycle
- ACTIVE
- Datasheet
- TSM-104-01-S-SV Datasheet PDF
- Category
- Connector
- Price
- From $0.2520(MOQ 1)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 4-position single-row 2.54 mm pitch SMD receptacle with 30 µin gold over 50 µin nickel contacts, providing low contact resistance and extended mating cycle reliability
- Easy-Latch-Probe (E.L.P.) feature allows in-circuit test probe access to each contact, simplifying board-level debug and production testing without removing the connector
- Staggered SMD pin layout increases solder joint strength and pull-out resistance compared to standard in-line SMD headers, improving mechanical robustness on the PCB
Applications
TSM-104-01-S-SV is used in PCB-to-PCB and module-to-baseboard interconnect designs requiring a compact 4-position single-row 2.54 mm pitch SMD receptacle with gold contacts and ELP test access. It is common in embedded computer modules, development kits, and instrumentation backplanes where in-circuit test probe capability and reliable gold-plated mating are required at standard 0.1" grid positions.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.1inch |
| Body Depth | 0.15inch |
| Body Length | 0.4inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.1inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | STAGGERED |
| PCB Contact Row Spacing | 3.175mm |
| Plating Thickness | 30u inch |
| Rated Current (Signal) | 7A |
| Reference Standard | UL |
| Terminal Pitch | 5.08mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 4 |
| UL Flammability Code | 94V-0 |
| Package | Header, Unshrouded - Single Row Staggered SMD Pin |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Costa Rica, Malaysia |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TSM-104-01-S-SV:
Frequently Asked Questions
What contact finish does TSM-104-01-S-SV use and how many mating cycles does it reliably support?
TSM-104-01-S-SV uses 30 µin (microinches) gold plating over 50 µin nickel on mating contacts. This contact finish meets SAMTEC's standard ELP reliability specification of at least 100 mating cycles with contact resistance remaining below 20 mΩ, making it suitable for 4-position module connectors that are frequently mated and unmated during development, testing, and field maintenance.
What does the E.L.P. feature on TSM-104-01-S-SV enable during PCB testing and debugging?
E.L.P. (Easy-Latch-Probe) provides dedicated probe access points at each of the 4 contact positions without requiring physical separation of the mated connector pair. Test engineers can touch standard oscilloscope or logic analyzer probes directly to the ELP access points to measure signal integrity, timing, and voltage levels on live circuits, reducing debug time by eliminating the need for test pads at 2.54 mm pitch.
How does the staggered SMD pin layout of TSM-104-01-S-SV improve PCB assembly reliability compared to in-line SMD headers?
Staggered SMD pins distribute solder joints in an offset pattern rather than a single in-line row, increasing the total solder joint area and resistance to lateral pull-out forces. For a 4-position connector body measuring 0.4 inch long, staggered solder joints can improve shear strength by 30% to 50% compared to in-line SMD footprints, reducing connector-lift failures in assemblies subject to cable pull forces or thermal cycling between -40°C and +85°C.
When is TSM-104-01-S-SV preferred over a through-hole 4-position 2.54 mm pitch header in a new PCB design?
TSM-104-01-S-SV is preferred in all-SMT production lines where through-hole components add a separate wave-solder or hand-soldering step that increases assembly cost. Its SMD footprint is compatible with standard reflow solder profiles at 260°C peak, supports automated pick-and-place at the same throughput as other SMD components, and the gold-plated 4-position single-row header occupies only 0.4 inch board length versus similar through-hole variants that require via drilling.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 1+ | $0.5400 | $0.54 |
| 45+ | $0.3600 | $16.20 |
| 168+ | $0.2520 | $42.34 |
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