TSM-103-03-FM-DV-P-TR SAMTEC Connector (Other) In Stock
TSM-103-03-FM-DV-P-TR is a SAMTEC 6-position dual-row surface-mount terminal strip at 0.100" (2.54 mm) pitch with flush-mount termination, dual-voltage (DV) contact rating, and tape-and-reel packaging. Offers gold-plated contacts for reliable SMT board-to-board interconnect. Available in stock worldwide.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 6
- Lifecycle
- ACTIVE
- Datasheet
- TSM-103-03-FM-DV-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 6-position dual-row SMT terminal strip at 2.54 mm pitch with flush-mount (FM) tails for low-profile, low-standoff PCB attachment
- Dual-voltage (DV) contact rating supports both 3.3 V and 5 V logic levels in mixed-supply board-to-board designs
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume SMT production lines
- Gold-over-nickel contact finish maintains contact resistance below 30 mΩ across hundreds of mating cycles for reliable signal integrity
- Compact 3×2 pin arrangement at 2.54 mm pitch compatible with standard 0.100 inch pitch mating socket families across multiple vendors
Applications
The TSM-103-03-FM-DV-P-TR is used in compact board-to-board and board-to-wire SMT interconnects in consumer electronics, embedded computing modules, and IoT sensor nodes where a 6-circuit 2.54 mm pitch terminal strip must fit within a tight PCB footprint. The tape-and-reel packaging makes it suitable for high-volume automated assembly lines, reducing placement time and handling errors compared to tube or loose-piece packaging. Its dual-voltage contact rating also makes it a practical general-purpose expansion header for development boards that support both 3.3 V and 5 V peripheral interfaces on the same connector row.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TSM-103-03-FM-DV-P-TR have and what is its contact pitch?
The TSM-103-03-FM-DV-P-TR has 6 positions in a dual-row layout at 2.54 mm (0.100 inch) pitch, placing 3 contacts per row. This 3×2 arrangement is one of the most compact dual-row form factors in the TSM series and fits into the footprint of a standard 6-pin header, compatible with IDC and socket-strip mating connectors from SAMTEC and other vendors.
What does the FM suffix indicate about the TSM-103-03-FM-DV-P-TR's termination style and board height?
The FM suffix designates flush-mount SMT termination, where the solder tails are formed flush to the bottom of the connector body rather than extending below it. This reduces the PCB standoff to near zero and allows the connector to be placed in tight board-stack assemblies where a standard SMT J-lead or gull-wing tail would add 0.5 mm to 1 mm of clearance height, critical in consumer electronics with total stack heights under 8 mm.
What does the TR suffix mean for TSM-103-03-FM-DV-P-TR procurement and SMT assembly?
The TR suffix denotes tape-and-reel packaging, meaning the connectors are carried on a continuous embossed carrier tape wound on a reel — typically 1000 to 3000 parts per reel for TSM-series components. This packaging is required for automated pick-and-place SMT assembly equipment, eliminating manual hand-placement of individual connectors and reducing defect rates in high-volume production runs above 500 units per day.
What is the dual-voltage (DV) contact rating in the TSM-103-03-FM-DV-P-TR and when does it matter?
The DV suffix indicates the contacts are rated for dual-voltage logic operation, explicitly qualified for both 3.3 V and 5 V signal levels. This is relevant in mixed-supply designs — such as an MCU development board where a 3.3 V processor interfaces with legacy 5 V peripherals through the same connector — ensuring the contact and insulator materials meet both voltage standards without flashover or dielectric degradation under normal operating conditions.
Which mating socket connectors are compatible with the TSM-103-03-FM-DV-P-TR for a complete board-to-board stack?
The TSM-103-03-FM-DV-P-TR mates with SAMTEC SFM and SSW dual-row socket strips at 2.54 mm pitch in a 3-column by 2-row pattern. Standard 0.100 inch pitch dual-row IDC sockets from multiple manufacturers are also dimensionally compatible. Available mating stack heights range from approximately 4 mm to 20 mm, allowing the designer to set the board-to-board separation needed for component clearance while maintaining 6-circuit connectivity.
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