TRF37B32IRTVT Texas Instruments Integrated Circuit (Quad Flat No-Lead) In Stock
The TRF37B32IRTVT is a dual-channel RF down-converter mixer from Texas Instruments covering 700 MHz to 2700 MHz with integrated IF amplifier and RF baluns in a single package. It provides two independent mixing channels ideal for diversity receivers and MIMO wireless systems. Housed in a 32-pin QFN package, it targets 4G LTE, 5G sub-6GHz, and broadband wireless base station and small cell receiver designs.
- Manufacturer
- Texas Instruments
- Package
- Quad Flat No-Lead
- Pin Count
- 33
- Lifecycle
- ACTIVE
- Datasheet
- TRF37B32IRTVT Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel down-converter mixer covering 700 MHz to 2700 MHz RF frequency range
- Integrated IF amplifier reduces external component count and BOM cost
- On-chip RF baluns simplify differential-to-single-ended signal conversion
- Supports diversity and MIMO receiver architectures in wireless systems
- 32-pin QFN package with heat sink slug for efficient thermal management
- RoHS compliant and lead-free for global regulatory compliance
Applications
The TRF37B32IRTVT is designed for 4G LTE and 5G sub-6GHz base station receivers, small cell remote radio units, and software-defined radio (SDR) platforms requiring dual-channel RF down-conversion. Its integrated baluns and IF amplifier reduce the number of external components, simplifying the PCB design of high-density receive chain modules. It is also applicable in point-to-point microwave backhaul and multi-band wireless communications systems operating across the 700 MHz to 2.7 GHz spectrum.
Specifications
| Pbfree Code | Yes |
| YTEOL | 15 |
| Additional Feature | RF frequency(Min)(MHz) is 700; RF frequency(Max)(MHz) is 2700 |
| JESD-30 Code | S-PQCC-N32 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Package Body Material | PLASTIC/EPOXY |
| Package Shape | SQUARE |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Cel) | 260 |
| Supply Voltage-Nom | 3.3V |
| Surface Mount | YES |
| Telecom IC Type | TELECOM CIRCUIT |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) |
| Terminal Form | NO LEAD |
| Terminal Pitch | 0.5mm |
| Terminal Position | QUAD |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Quad Flat No-Lead |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.39.00.90 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What frequency range does the TRF37B32IRTVT support?
The TRF37B32IRTVT supports an RF input frequency range from 700 MHz to 2700 MHz, covering major cellular frequency bands including LTE Band 12/17 at 700 MHz, AWS at 1700 MHz, and 2.5 GHz/2.6 GHz 5G sub-6GHz bands. This broad coverage makes it suitable for multi-band base station receiver designs.
Does the TRF37B32IRTVT include an IF amplifier?
Yes, the TRF37B32IRTVT integrates an IF amplifier along with RF baluns in a single chip, reducing the need for external gain stages and passive components. This integration simplifies receiver chain design, lowers bill-of-materials cost, and reduces PCB area in space-constrained base station and small cell applications.
How many channels does the TRF37B32IRTVT have?
The TRF37B32IRTVT features two independent RF down-conversion channels, enabling diversity receiver configurations, 2x2 MIMO implementations, and dual-band receive architectures. Each channel includes its own mixer, balun, and IF amplifier stage for independent frequency conversion.
What is the package type of the TRF37B32IRTVT?
The TRF37B32IRTVT is packaged in a 32-pin QFN (Quad Flat No-lead) with an integrated heat sink slug for improved thermal dissipation. The compact QFN form factor minimizes PCB footprint while providing the thermal performance required for RF power handling in wireless infrastructure equipment.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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