TPA3123D2PWPG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The TPA3123D2PWPG4 is a dual-channel stereo Class-D audio amplifier from Texas Instruments delivering 25W nominal output power per channel in a 24-pin HTSSOP package with exposed pad. It features high switching efficiency to reduce heat without bulky heatsinks and drives two speaker channels simultaneously. Ideal for multimedia speaker systems, home audio receivers, and consumer electronics requiring compact, efficient stereo amplification.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- ACTIVE
- Datasheet
- TPA3123D2PWPG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-channel stereo Class-D amplifier with 25W nominal output power per channel
- 24-pin HTSSOP package with exposed pad (R-PDSO-G24) for efficient thermal dissipation
- High-efficiency switching topology reduces heat generation and eliminates heatsink requirements
- Two independent audio channels for direct stereo speaker drive from a single IC
- RoHS compliant (JESD-609 e4) with plastic/epoxy body for commercial compliance
- Compact TSSOP footprint enables space-efficient stereo audio system PCB designs
Applications
The TPA3123D2PWPG4 is used in desktop computer speakers, powered monitor speakers, home theater systems, and multimedia audio docking stations where efficient stereo 25W-per-channel output is needed in a compact package. Its Class-D topology and exposed pad thermal design make it suitable for battery-powered and mains-powered consumer audio products requiring maximum efficiency with minimal board space.
Specifications
| YTEOL | 15 |
| Consumer IC Type | CLASS D AUDIO AMPLIFIER |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Number of Channels | 2 |
| Number of Functions | 1 |
| Output Power-Nom | 25W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP24,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 37mA |
| Supply Voltage-Max (Vsup) | 30V |
| Supply Voltage-Min (Vsup) | 10V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 3 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What output power does the TPA3123D2PWPG4 provide?
The TPA3123D2PWPG4 delivers 25W nominal output power per channel across two stereo audio channels, making it suitable for powered desktop speakers, multimedia monitors, and home theater systems requiring efficient Class-D stereo amplification.
What type of package is the TPA3123D2PWPG4 and how is thermal management handled?
The TPA3123D2PWPG4 is housed in a 24-pin HTSSOP package (R-PDSO-G24) with an exposed thermal pad on the underside. The exposed pad allows direct thermal conduction to the PCB, enabling efficient heat dissipation without bulky external heatsinks.
What are the typical applications for the TPA3123D2PWPG4?
The TPA3123D2PWPG4 is ideal for stereo-powered desktop speakers, home audio amplifiers, multimedia docking stations, and consumer electronics where dual-channel Class-D amplification at 25W per channel is required in a space-constrained, surface-mount package.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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