TPA3001D1PWPRG4 Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
The TPA3001D1PWPRG4 is a mono Class-D audio power amplifier from Texas Instruments delivering 20W output power at 36dB gain with 20kHz bandwidth. It integrates a single-channel speaker driver in a 24-pin HTSSOP package with an exposed thermal pad, making it ideal for portable and home audio systems requiring efficient, high-power mono audio amplification.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- OBSOLETE
- Datasheet
- TPA3001D1PWPRG4 Datasheet PDF
- Category
- Integrated Circuit
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Single-channel Class-D audio amplifier with 20W nominal output power
- High gain: 36dB for driving speakers directly from low-level audio sources
- 20kHz audio bandwidth covering the full human hearing range
- High-efficiency switching amplifier minimizing heat dissipation
- 24-pin HTSSOP package with exposed thermal pad for thermal management
- Lead-free and RoHS compliant (JESD-609 e4)
Applications
The TPA3001D1PWPRG4 is used in portable Bluetooth speakers, soundbars, docking stations, and home audio amplifier designs where efficient single-channel 20W mono audio amplification is required. Its Class-D architecture provides high power efficiency compared to linear amplifiers, reducing battery consumption and heat generation in space-constrained consumer electronics audio products.
Specifications
| Pbfree Code | Yes |
| YTEOL | 0 |
| Bandwidth-Nom | 20kHz |
| Consumer IC Type | CLASS D AUDIO AMPLIFIER |
| Gain | 36dB |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Output Power-Nom | 20W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP24,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 15mA |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TPA3001D1PWPRG4:
Frequently Asked Questions
What output power does the TPA3001D1PWPRG4 deliver?
The TPA3001D1PWPRG4 delivers a nominal output power of 20W into a speaker load. As a Class-D switching amplifier, it achieves this power level with significantly higher efficiency than linear Class-A or Class-AB amplifiers, converting more of the supply power into audio output and generating less waste heat.
What is the gain and bandwidth of the TPA3001D1PWPRG4?
The TPA3001D1PWPRG4 provides a nominal gain of 36dB and an audio bandwidth of 20kHz, covering the full audible frequency range from approximately 20Hz to 20kHz. The high gain allows the amplifier to drive an 8-ohm or 4-ohm speaker directly from a standard line-level or DAC output signal without external pre-amplification.
Why is Class-D amplification used in the TPA3001D1PWPRG4?
Class-D amplification uses pulse-width modulation (PWM) switching to convert audio signals into high-frequency switched outputs, achieving typical efficiencies of 85-90% compared to 50-70% for Class-AB amplifiers. This higher efficiency means less power is wasted as heat, allowing the TPA3001D1PWPRG4 to deliver 20W in a small package without requiring large heatsinks, making it ideal for compact audio products.
What package does the TPA3001D1PWPRG4 use and how does it handle thermal dissipation?
The TPA3001D1PWPRG4 is housed in a 24-pin HTSSOP (High-Voltage Thin Shrink Small Outline Package) with an exposed thermal pad on the bottom. The thermal pad must be soldered to a PCB copper pour or ground plane to conduct heat away from the IC, allowing the device to sustain 20W output power without exceeding its maximum junction temperature.
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Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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