TPA3001D1PWP Texas Instruments Integrated Circuit (Small Outline Packages) In Stock
TPA3001D1PWP is a 20W mono Class D audio amplifier IC from Texas Instruments with 36dB gain, 20kHz bandwidth, and 24-pin SOIC package. From $6.59, in stock worldwide shipping.
- Manufacturer
- Texas Instruments
- Package
- Small Outline Packages
- Pin Count
- 24
- Lifecycle
- NOT RECOMMENDED
- Datasheet
- TPA3001D1PWP Datasheet PDF
- Category
- Integrated Circuit
- Price
- From $6.5900(MOQ 23)
- Temp Range
- -40.0°C to 85.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20W Mono Class D Audio Amplifier with high efficiency output
- 36dB fixed gain with 20kHz audio bandwidth for full-range audio performance
- Single-channel design in compact 24-pin SOIC package for space-saving integration
- Lead-free (Pb-free) construction meeting RoHS compliance standards
Applications
The TPA3001D1PWP is ideal for portable and battery-powered audio applications where high efficiency and compact size are critical, such as Bluetooth speakers, soundbars, and multimedia docking stations. Its 20W output power and Class D topology make it well-suited for consumer electronics requiring low heat dissipation and extended battery life. The device is also commonly used in automotive infotainment systems and desktop speaker amplifier designs.
Specifications
| Pbfree Code | Yes |
| YTEOL | 3.9 |
| Bandwidth-Nom | 20kHz |
| Consumer IC Type | CLASS D AUDIO AMPLIFIER |
| Gain | 36dB |
| JESD-30 Code | R-PDSO-G24 |
| JESD-609 Code | e4 |
| Number of Channels | 1 |
| Number of Functions | 1 |
| Output Power-Nom | 20W |
| Package Body Material | PLASTIC/EPOXY |
| Package Equivalence Code | TSSOP24,.25 |
| Package Shape | RECTANGULAR |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Cel) | 260 |
| Qualification Status | Not Qualified |
| Supply Current-Max | 15mA |
| Supply Voltage-Max (Vsup) | 18V |
| Supply Voltage-Min (Vsup) | 8V |
| Surface Mount | YES |
| Technology | CMOS |
| Temperature Grade | INDUSTRIAL |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) |
| Terminal Form | GULL WING |
| Terminal Pitch | 0.65mm |
| Terminal Position | DUAL |
| Time@Peak Reflow Temperature-Max (s) | 30 |
| Package | Small Outline Packages |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| Moisture Sensitivity Level | MSL 2 |
| ECCN | EAR99 |
| HTS Code | 8542.33.00.01 |
| Country of Origin | Taiwan |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TPA3001D1PWP:
Frequently Asked Questions
What is the output power and gain of the TPA3001D1PWP?
The TPA3001D1PWP delivers 20W nominal output power into an appropriate load with a fixed gain of 36dB. It supports a 20kHz audio bandwidth, making it suitable for full-range audio reproduction in consumer and portable applications.
What package does the TPA3001D1PWP use and what are its dimensions?
The TPA3001D1PWP comes in a 24-pin Small Outline IC (SOIC) package, JESD-30 code R-PDSO-G24. This compact surface-mount package is ideal for space-constrained PCB designs in portable audio devices and consumer electronics.
What are typical applications for the TPA3001D1PWP Class D amplifier?
The TPA3001D1PWP is commonly used in portable Bluetooth speakers, soundbars, multimedia docking stations, desktop speaker systems, and automotive infotainment. Its Class D topology provides high efficiency with minimal heat generation, extending battery life in portable designs.
Is the TPA3001D1PWP RoHS compliant and lead-free?
Yes, the TPA3001D1PWP is fully Pb-free (lead-free) with a Pbfree Code of Yes and JESD-609 Code e4, making it compliant with RoHS environmental directives. It is suitable for all modern consumer and industrial electronics manufacturing.
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About Texas Instruments
Texas Instruments (TI) is a global semiconductor company headquartered in Dallas, Texas. TI designs and manufactures analog and embedded processing chips used in industrial, automotive, consumer, communications, and enterprise systems.
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