TMM-110-01-T-S-SM-P-TR SAMTEC Connector (Header, Unshrouded - Single Row Staggered SMD Pin) In Stock
SAMTEC TMM-110-01-T-S-SM-P-TR is a 10-position single-row SMT board-to-board header with 2 mm pitch, staggered low-profile configuration, matte tin over nickel contacts, and polarized keying for reliable surface mount interconnection. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Header, Unshrouded - Single Row Staggered SMD Pin
- Pin Count
- 10
- Lifecycle
- ACTIVE
- Datasheet
- TMM-110-01-T-S-SM-P-TR Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 10-position single-row 2 mm pitch staggered SMT header provides low-profile board-to-board signal interconnect in 0.787 inch body length
- Staggered contact configuration improves SMT solder joint strength and mechanical retention by distributing solder stress across offset pad pattern
- Matte tin over nickel (50 µin) contact finish delivers robust mating durability with low contact resistance for signal and power applications
Applications
TMM-110-01-T-S-SM-P-TR is designed for compact board-to-board and wire-to-board connections in industrial sensors, consumer electronics, and embedded computing modules where a single-row 2 mm pitch SMT header is required with minimal above-board height. The staggered pin configuration anchors the connector body securely to the PCB pads, preventing connector tilt or lift during cable mating forces or automated assembly handling. Its polarized (P) keying and tape-and-reel packaging make it well suited for automated SMT assembly lines producing medical devices, IoT nodes, or handheld instruments in high volumes.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 4 Weeks, 4 Days |
| YTEOL | 8 |
| Additional Feature | LOW PROFILE, STAGGERED CONFIGURATION |
| Body Breadth | 0.078inch |
| Body Depth | 0.109inch |
| Body Length | 0.787inch |
| Connector Type | BOARD CONNECTOR |
| Contact Design | PREASSEM CONN |
| Contact Finish Mating | MATTE TIN OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 1 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | STAGGERED |
| PCB Contact Row Spacing | 2.03mm |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 4mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 10 |
| UL Flammability Code | 94V-0 |
| Package | Header, Unshrouded - Single Row Staggered SMD Pin |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the body length and pitch of TMM-110-01-T-S-SM-P-TR, and how does this affect routing density on a compact PCB?
TMM-110-01-T-S-SM-P-TR has a body length of 0.787 inch (20 mm) with 10 contacts on a 2 mm pitch single-row layout. Compared to a 2.54 mm pitch 10-position connector measuring 25.4 mm, the 2 mm pitch saves 5.4 mm of board edge length, allowing an additional SMT component or routing channel to be placed within the freed space on compact PCBs under 40 mm in width used in wearable and industrial sensor modules.
How does the staggered contact design of TMM-110-01-T-S-SM-P-TR improve mechanical performance compared to standard in-line SMT headers?
The staggered contact configuration of TMM-110-01-T-S-SM-P-TR offsets alternating pins by approximately 0.4 mm laterally, distributing solder joint stress across a wider pad pattern. This reduces the risk of connector rotation or tilt during mating and extends solder fatigue life by 20% to 40% compared to standard in-line SMT headers under thermal cycling conditions from -40°C to +85°C. The staggered design also increases peel resistance, critical for connectors subject to repeated cable plug-unplug forces exceeding 5 N.
What contact finish does TMM-110-01-T-S-SM-P-TR use, and how many mating cycles does it support reliably?
TMM-110-01-T-S-SM-P-TR uses matte tin over nickel plating with approximately 50 µin tin thickness on the mating contact surfaces. This finish provides reliable low contact resistance below 30 mΩ for the first 30 to 50 mating cycles, which is adequate for board-to-board connections in field-serviceable equipment requiring occasional module swaps. For applications demanding more than 100 mating cycles or lower contact resistance below 10 mΩ, gold-plated alternatives in the SAMTEC TMM series with G suffix contact finish should be specified instead.
When should TMM-110-01-T-S-SM-P-TR be selected over a through-hole 2 mm pitch header for an IoT gateway board?
TMM-110-01-T-S-SM-P-TR should be chosen for an IoT gateway board when the PCB design is fully surface mount with no through-hole process, eliminating 10 drill operations per connector and reducing PCB fabrication cost. Its low-profile SMT form also allows placement on the secondary side of a double-sided board with under 4 mm clearance to adjacent components, which through-hole pins penetrating 1.6 mm thick FR4 boards cannot achieve. The tape-and-reel packaging also enables continuous automated placement at up to 3,000 parts per hour on standard SMT lines.
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