TMM-106-01-T-D-SM SAMTEC Connector (Other) In Stock
SAMTEC TMM-106-01-T-D-SM is a 12-position dual-row surface mount board connector with 2.00 mm pitch, phosphor bronze contacts, and matte tin over nickel plating for reliable PCB-to-board interconnection. Its 0.472" body length and SMT termination simplify automated assembly. Available in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 12
- Lifecycle
- ACTIVE
- Datasheet
- TMM-106-01-T-D-SM Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 105.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 12-position dual-row (2x6) SMT board connector with 2.00 mm pitch for versatile, space-efficient PCB-to-board connections
- Phosphor bronze contacts with matte tin over nickel plating providing reliable electrical conductivity and corrosion resistance
- Surface mount termination with compact 0.472" x 0.155" body enabling high-density PCB layouts in automated assembly processes
Applications
The TMM-106-01-T-D-SM is designed for board-to-board stacking and mezzanine connector applications in industrial control systems, telecommunications equipment, and embedded computing platforms. Its 2.00 mm pitch dual-row layout supports reliable signal and power distribution between PCB layers in automation and instrumentation designs. Engineers use this connector in data acquisition systems and motor drive boards where robust SMT soldering and compact footprint are essential.
Specifications
| Pbfree Code | Yes |
| YTEOL | 8.4 |
| Body Breadth | 0.155inch |
| Body Depth | 0.109inch |
| Body Length | 0.472inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | MATTE TIN OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 1050VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.079inch |
| Mating Contact Row Spacing | 0.079inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 4.27mm |
| Rated Current (Signal) | 3.3A |
| Reference Standard | UL |
| Terminal Pitch | 2mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 12 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TMM-106-01-T-D-SM connector offer for board interconnection?
The TMM-106-01-T-D-SM is a 12-position dual-row (2x6) connector with a 2.00 mm pitch, providing 12 individual contacts in a compact SMT package. This 2.00 mm center spacing balances signal density and ease of soldering for reliable board-to-board connections in industrial and embedded PCB designs.
Which applications benefit most from the TMM-106-01-T-D-SM matte tin contact plating in harsh environments?
The matte tin over nickel plating on TMM-106-01-T-D-SM contacts provides good corrosion resistance at lower cost than gold plating, making it suitable for industrial control panels, motor drive systems, and HVAC equipment operating from -40°C to +85°C. The nickel barrier layer under the tin finish prevents copper diffusion and maintains consistent contact resistance over thousands of mating cycles.
When would a designer choose TMM-106-01-T-D-SM over a through-hole equivalent for a compact embedded system?
The surface mount design of TMM-106-01-T-D-SM eliminates the need for through-holes, reducing PCB layers and allowing component placement on both sides of the board. With a body dimension of 0.472" x 0.155" x 0.109" and 12 contacts at 2.00 mm pitch, it occupies significantly less board area than through-hole alternatives, making it preferable for compact embedded computing modules and FPGA daughterboard interfaces.
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