TFM-150-11-S-D SAMTEC Connector (Other) In Stock

TFM-150-11-S-D is a SAMTEC Tiger Eye high-reliability terminal strip receptacle with 0.050 inch pitch, 30 µin gold over 50 µin nickel mating contacts, and ELP enhanced wipe for superior signal integrity. Available from stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-150-11-S-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
100
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Tiger Eye contact system with 0.050 inch pitch delivers high-density board interconnects in compact PCB space
  • 30 µin gold over 50 µin nickel mating contact finish ensures robust conductivity and long mating-cycle life
  • ELP (Enhanced Wipe) feature improves contact cleaning action during mating for reliable signal integrity
  • High-reliability receptacle design rated for demanding industrial and aerospace-grade board connection applications

Applications

TFM-150-11-S-D is applied in high-density board-to-board and cable-to-board interconnect designs where a 0.050 inch pitch terminal strip is required for space-constrained PCB layouts. It is commonly used in aerospace electronics, defense subsystems, and high-reliability industrial equipment that demand gold-plated contact surfaces with enhanced wipe characteristics for repeatable low-resistance connections. Its ELP feature and robust plating also suit test and measurement equipment that undergoes frequent mating cycles.

Specifications

Pbfree CodeYes
YTEOL9.15
Additional FeatureE.L.P.
Body Breadth0.225inch
Body Length2.625inch
Body/Shell StyleRECEPTACLE
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (30) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting Option 1GUIDE SLOT
Mounting Option 2LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness30u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)3.2A
Reference StandardUL, CSA
Terminal Pitch1.27mm
Termination TypeSOLDER
Total Number of Contacts100
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TFM-150-11-S-D Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact plating specification does TFM-150-11-S-D use and why does it matter for connector reliability?

TFM-150-11-S-D uses 30 µin gold over 50 µin nickel on mating contacts, providing exceptional corrosion resistance and stable low-resistance contact across thousands of mating cycles. The thick nickel underplating acts as a diffusion barrier that extends the operational life of the gold layer, making this connector suitable for high-reliability aerospace and defense applications.

How does the 0.050 inch pitch of TFM-150-11-S-D compare to standard 0.100 inch pitch connectors in dense PCB designs?

At 0.050 inch pitch, TFM-150-11-S-D accommodates twice as many contacts per linear inch compared to standard 0.100 inch pitch connectors, enabling higher circuit density on space-constrained PCBs. This makes it particularly valuable in compact avionics, instrumentation, and embedded computing boards where maximizing I/O count within a fixed footprint is critical.

What does the ELP feature on TFM-150-11-S-D mean and which designs benefit from it?

ELP stands for Enhanced Lead Press-fit or Enhanced Wipe, a SAMTEC feature that improves the wiping action of contacts during insertion, cleaning oxide layers and debris from the mating surfaces. Designs that involve infrequent mating in environments where contacts may oxidize — such as field-serviceable industrial modules or lab test fixtures — benefit significantly from the ELP feature on TFM-150-11-S-D.

In which procurement scenarios is TFM-150-11-S-D a stronger choice than alternative 0.050 inch pitch receptacles from other manufacturers?

TFM-150-11-S-D is a stronger choice when procurement specifications mandate 30 µin minimum gold plating, ELP contact enhancement, and a guaranteed factory lead time under 4 weeks. SAMTEC's Tiger Eye series is also preferred in programs requiring long product life cycles with a YTEOL rating of 9.15 years, making it suitable for long-running defense and industrial programs avoiding mid-program part obsolescence.

Related Guides

Why Buy from FindMyChip

Authorized Source
Verified supply chain with full traceability & inspection
$
Competitive Pricing
Factory-direct from China distributors, low MOQ
Fast Shipping
DHL Express 3–5 days · FedEx/UPS 5–7 days worldwide
Quality Guaranteed
30-day replacement for defective parts, no questions asked

About SAMTEC

SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.

AvailabilityIn Stock
Reference Price (USD)
Contact for Price
Buy from 1pc · Factory-direct pricing
pcs

In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

Response time is incredible — usually under 4 hours. They understand that production lines can't wait.

JW
James Wright
Supply Chain Director, CircuitPro Ltd, UK