TFM-150-11-S-D SAMTEC Connector (Other) In Stock
TFM-150-11-S-D is a SAMTEC Tiger Eye high-reliability terminal strip receptacle with 0.050 inch pitch, 30 µin gold over 50 µin nickel mating contacts, and ELP enhanced wipe for superior signal integrity. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TFM-150-11-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Tiger Eye contact system with 0.050 inch pitch delivers high-density board interconnects in compact PCB space
- 30 µin gold over 50 µin nickel mating contact finish ensures robust conductivity and long mating-cycle life
- ELP (Enhanced Wipe) feature improves contact cleaning action during mating for reliable signal integrity
- High-reliability receptacle design rated for demanding industrial and aerospace-grade board connection applications
Applications
TFM-150-11-S-D is applied in high-density board-to-board and cable-to-board interconnect designs where a 0.050 inch pitch terminal strip is required for space-constrained PCB layouts. It is commonly used in aerospace electronics, defense subsystems, and high-reliability industrial equipment that demand gold-plated contact surfaces with enhanced wipe characteristics for repeatable low-resistance connections. Its ELP feature and robust plating also suit test and measurement equipment that undergoes frequent mating cycles.
Specifications
| Pbfree Code | Yes |
| YTEOL | 9.15 |
| Additional Feature | E.L.P. |
| Body Breadth | 0.225inch |
| Body Length | 2.625inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 100 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating specification does TFM-150-11-S-D use and why does it matter for connector reliability?
TFM-150-11-S-D uses 30 µin gold over 50 µin nickel on mating contacts, providing exceptional corrosion resistance and stable low-resistance contact across thousands of mating cycles. The thick nickel underplating acts as a diffusion barrier that extends the operational life of the gold layer, making this connector suitable for high-reliability aerospace and defense applications.
How does the 0.050 inch pitch of TFM-150-11-S-D compare to standard 0.100 inch pitch connectors in dense PCB designs?
At 0.050 inch pitch, TFM-150-11-S-D accommodates twice as many contacts per linear inch compared to standard 0.100 inch pitch connectors, enabling higher circuit density on space-constrained PCBs. This makes it particularly valuable in compact avionics, instrumentation, and embedded computing boards where maximizing I/O count within a fixed footprint is critical.
What does the ELP feature on TFM-150-11-S-D mean and which designs benefit from it?
ELP stands for Enhanced Lead Press-fit or Enhanced Wipe, a SAMTEC feature that improves the wiping action of contacts during insertion, cleaning oxide layers and debris from the mating surfaces. Designs that involve infrequent mating in environments where contacts may oxidize — such as field-serviceable industrial modules or lab test fixtures — benefit significantly from the ELP feature on TFM-150-11-S-D.
In which procurement scenarios is TFM-150-11-S-D a stronger choice than alternative 0.050 inch pitch receptacles from other manufacturers?
TFM-150-11-S-D is a stronger choice when procurement specifications mandate 30 µin minimum gold plating, ELP contact enhancement, and a guaranteed factory lead time under 4 weeks. SAMTEC's Tiger Eye series is also preferred in programs requiring long product life cycles with a YTEOL rating of 9.15 years, making it suitable for long-running defense and industrial programs avoiding mid-program part obsolescence.
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