TFM-140-12-F-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-140-12-F-D-LC is an 80-position dual-row high-reliability Tiger Eye surface-mount vertical terminal strip at 0.050-inch (1.27 mm) pitch, with gold-flash mating contacts, split board-lock retention, and a 2.375-inch body length. Available with worldwide shipping for high-density PCB interconnects.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 80
- Lifecycle
- ACTIVE
- Datasheet
- TFM-140-12-F-D-LC Datasheet PDF
- Category
- Connector
- Price
- From $4.1660(MOQ 10)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-140-12-F-D-LC?
- High-reliability Tiger Eye contact design provides wiping action during mating, achieving contact resistance below 20 mΩ and rated for 500+ mating cycles
- 0.050-inch (1.27 mm) pitch with 80 dual-row positions delivers twice the signal density of 0.100-inch headers in a 2.375 × 0.225 inch footprint
- Gold flash mating contacts over nickel barrier minimize corrosion and oxidation for stable low-ohmic connections in humid or harsh industrial environments
- Split board-lock retention system mechanically secures the connector to the PCB before and during reflow, preventing tombstoning on the 1.27 mm pitch pads
- LC (low current) signal-optimized contacts reduce pin thermal mass for uniform solder joint formation across all 80 positions during standard 260 °C lead-free reflow
What is TFM-140-12-F-D-LC used for?
The TFM-140-12-F-D-LC is designed for high-density mezzanine and board-stacking applications in FPGA daughter cards, telecom line cards, and defense electronics, where the 0.050-inch pitch reduces PCB footprint by 50% compared to 0.100-inch alternatives. Its Tiger Eye contact mechanism and 500-cycle mating rating suit repeated module swapping in field-serviceable embedded computing platforms. The 2.375-inch body length and 80-position dual-row layout also make it a strong candidate for high-channel-count SerDes and parallel bus interconnects in compact embedded computing form factors.
What are the specifications of TFM-140-12-F-D-LC?
| Pbfree Code | Yes |
| YTEOL | 9.4 |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.29inch |
| Body Length | 2.375inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD FLASH |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Plating Thickness | FLASH inch |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 80 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Where can I find the TFM-140-12-F-D-LC datasheet?
TFM-140-12-F-D-LC Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-140-12-F-D-LC?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the Tiger Eye contact design in TFM-140-12-F-D-LC and why does it matter?
The Tiger Eye contact is SAMTEC's proprietary dual-beam socket contact design used in the TFM series. It provides a wiping action during insertion that clears oxide and contamination from mating pin surfaces, achieving and maintaining contact resistance below 20 mΩ across 500+ mating cycles. This superior contact reliability makes the TFM-140-12-F-D-LC preferred for high-reliability mezzanine interconnects in telecommunications, defense, and industrial computing applications where intermittent contact failures are unacceptable.
How does the 0.050-inch pitch of TFM-140-12-F-D-LC benefit high-density PCB designs?
At 0.050-inch (1.27 mm) pitch, the TFM-140-12-F-D-LC packs 80 positions into a body length of 2.375 inches. An equivalent 0.100-inch connector would need 4.75 inches for the same pin count, consuming twice the PCB real estate. This density advantage is critical in FPGA mezzanine boards, high-speed SerDes breakout cards, and space-constrained mil-aero avionics where board area directly impacts SWaP (Size, Weight, and Power) budgets.
What does the split board-lock retention system on TFM-140-12-F-D-LC do?
The split board-lock retention system consists of two mechanical locking posts integrated into the TFM-140-12-F-D-LC body that press-fit into corresponding holes in the PCB. This holds the connector flat against the board surface during pick-and-place and reflow soldering, preventing the connector from lifting, shifting, or tombstoning during the 260 °C peak reflow thermal cycle. Post-reflow, the board locks also provide mechanical strain relief against lateral forces during mating and de-mating operations.
What contact finish does TFM-140-12-F-D-LC use on the mating and termination surfaces?
The TFM-140-12-F-D-LC uses gold flash over nickel on the mating contact surfaces, providing corrosion resistance and low contact resistance for signal-level connections. The termination (solder) side uses tin over nickel, which is compatible with standard lead-free solder paste and reflow profiles. Gold flash on signal contacts provides approximately 0.05–0.1 µm of gold thickness, sufficient for reliable low-level signal connections while keeping connector cost lower than thick hard-gold alternatives.
When should a designer choose TFM-140-12-F-D-LC over a 0.100-inch pitch dual-row header?
Choose TFM-140-12-F-D-LC when the board design requires 80 or more signal connections and board area is constrained to less than 3 inches for the connector zone, since the 0.050-inch pitch cuts connector PCB footprint in half compared to 0.100-inch alternatives. It is also the better choice when mating reliability over 500+ cycles is required, such as hot-swappable compute modules or test-jig interfaces, where the Tiger Eye dual-beam contacts outperform standard single-beam 0.100-inch headers on contact durability and wipe consistency.
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| Qty. | Unit Price | Ext. Price |
|---|---|---|
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| 50+ | $6.5000 | $325.00 |
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