TFM-131-01-LM-D-A-P-TR SAMTEC Connector (Other) In Stock
The SAMTEC TFM-131-01-LM-D-A-P-TR is a high-reliability Tiger Eye dual-row terminal strip with 0.050 inch (1.27 mm) pitch and 62 positions, offered in a low-profile horizontal orientation with tape-and-reel packaging for automated SMT assembly. Gold-plated Tiger Eye contacts deliver consistent low-resistance connections over thousands of mating cycles. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 62
- Lifecycle
- ACTIVE
- Datasheet
- TFM-131-01-LM-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 62-position dual-row layout at 0.050 inch (1.27 mm) pitch for maximum signal density in compact board-stacking applications
- Tape-and-reel (-TR) packaging enables uninterrupted automated SMT pick-and-place assembly in high-volume PCB production
- Tiger Eye contact mechanism delivers high normal force for stable sub-20 milliohm contact resistance across extended mating and thermal cycling ranges
Applications
The TFM-131-01-LM-D-A-P-TR is designed for high-density FPGA mezzanine cards, high-speed embedded processor modules, and RF signal conditioning boards where 62 circuits at 0.050 inch pitch must be interconnected with low-profile clearance and high contact reliability. Its tape-and-reel format enables fully automated SMT assembly, reducing per-unit labor cost in volume manufacturing. Design engineers select this connector for backplane daughtercard interfaces, compact communication modules, and rugged industrial computing stackups requiring both high circuit count and minimal mated height.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the low-profile horizontal (-LM) orientation of TFM-131-01-LM-D-A-P-TR benefit height-constrained FPGA module stacking?
The -LM horizontal orientation positions the 62-position connector body parallel to the PCB surface, reducing the above-board height compared to a vertical SMT or through-hole TFM variant. For FPGA mezzanine cards operating within a 4 mm or 6 mm board-to-board stack pitch at 0.050 inch contact spacing, this horizontal low-profile geometry ensures the connector does not protrude beyond the allowed clearance envelope, enabling slimmer card cage designs in embedded computing applications.
For a 62-circuit high-speed bus interface, what contact reliability does the Tiger Eye mechanism provide in TFM-131-01-LM-D-A-P-TR?
SAMTEC's Tiger Eye contact design applies above-average normal force at each of the 62 contact positions, maintaining contact resistance below 20 milliohms throughout the connector's rated mating cycle life. This high normal force keeps the contact stable under mechanical vibration and thermal excursions from -55 °C to +125 °C, which is critical for 62-circuit high-speed digital buses on rugged embedded modules and avionics boards where signal integrity must be preserved across the full operational temperature range.
How does TFM-131-01-LM-D-A-P-TR's tape-and-reel packaging affect per-unit assembly cost relative to tray packaging?
Tape-and-reel packaging allows the 62-position connector to feed continuously into a pick-and-place machine without operator intervention to refill component trays, which reduces placement cycle time and eliminates manual handling defects. For production runs of 500 or more PCBs, the -TR packaging typically reduces per-connector assembly labor by eliminating 5 to 10 seconds of tray-reload downtime per board, delivering measurable cost savings over tray-packaged alternatives at the same 0.050 inch pitch and position count.
Related Guides
1206 100 uF MLCC Design Guide for Compact Bulk Decoupling
Design guidance for applying CL31A107MQHNNNE and related 1206 MLCCs in compact bulk decoupling networks.
Jul 3, 2026
0402 10 nF MLCC Design Guide for High-Speed Decoupling
Practical design guidance for using CL05B103KB5NNNC and related 0402 MLCCs in high-speed decoupling networks.
Jul 3, 2026
CL31A107MQHNNNE 1206 100 uF MLCC Selection Guide
How to choose CL31A107MQHNNNE and related 1206 MLCCs for low-voltage bulk capacitance and regulator stability.
Jul 2, 2026
CL05B103KB5NNNC 0402 10 nF X7R MLCC Selection Guide
How to choose CL05B103KB5NNNC and related 0402 MLCCs for bypassing, filtering, voltage derating, and sourcing.
Jul 2, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”