TFM-130-03-L-D-LC SAMTEC Connector (Other) In Stock
SAMTEC TFM-130-03-L-D-LC is a 60-position dual-row high-reliability Tiger Eye receptacle strip on 0.050" pitch, with gold (15 µin) over nickel (50 µin) mating contacts and split board-lock retention. RoHS compliant and designed for high-density SMT board-to-board connections. In stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFM-130-03-L-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Tiger Eye contact design with gold (15 µin) over nickel (50 µin) mating finish provides low, stable contact resistance and high mating-cycle durability in dense 0.050" pitch assemblies
- Split board-lock retention feature mechanically anchors the connector to the PCB, preventing pull-out under vibration or repeated mating without additional hardware
- 60-position dual-row layout in a 1.625 inch body delivers high channel density for board-to-board signal routing in space-constrained SMT designs
Applications
The TFM-130-03-L-D-LC serves high-density board-to-board interconnects in embedded computing, telecommunications, and industrial automation where 60 signal channels must pass through a compact 0.050" pitch footprint. The split board-lock feature provides mechanical stability in vibration-prone environments such as industrial rack systems and vehicular electronics. Its RoHS-compliant construction meets environmental compliance requirements for global market deployment.
Specifications
| YTEOL | 9.15 |
| Additional Feature | ROHS COMPLIANT |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.22inch |
| Body Length | 1.625inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (15) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 10u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 5A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish does the TFM-130-03-L-D-LC use, and how does it improve connector reliability?
The TFM-130-03-L-D-LC uses gold (15 µin) over nickel (50 µin) on the mating contacts. The 15 µin gold layer provides corrosion resistance and low contact resistance, while the 50 µin nickel barrier prevents gold diffusion into the base metal, extending reliable performance across hundreds of mating cycles in high-density 0.050" pitch SMT connectors.
What is the function of the split board-lock on TFM-130-03-L-D-LC and when is it critical?
The split board-lock feature mechanically clamps the 1.625 inch connector body to the PCB through split tines that grip the board edge. This retention is critical in applications subject to vibration or frequent connector mating, such as industrial automation panels and mobile embedded systems, where solder joints alone cannot maintain the required pull-out force over time.
For a 60-channel signal routing requirement at 0.050" pitch, how does TFM-130-03-L-D-LC fit into board layout?
The TFM-130-03-L-D-LC provides 60 positions in a dual-row 1.625 inch body at 0.050" (1.27 mm) pitch, occupying a modest board footprint compared to 0.100" alternatives at equivalent channel count. This compact layout is particularly valuable in mezzanine card and module stacking designs where lateral board space is constrained to under 2 inches.
Is the TFM-130-03-L-D-LC suitable for designs that must meet international environmental standards?
Yes, the TFM-130-03-L-D-LC is RoHS compliant, meaning it is manufactured without restricted hazardous substances such as lead and certain halogens. This compliance makes it suitable for products sold in the European Union and other markets with environmental restrictions, including consumer electronics, industrial equipment, and telecommunications infrastructure operating under RoHS directives.
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