TFM-130-03-L-D-LC SAMTEC Connector (Other) In Stock

SAMTEC TFM-130-03-L-D-LC is a 60-position dual-row high-reliability Tiger Eye receptacle strip on 0.050" pitch, with gold (15 µin) over nickel (50 µin) mating contacts and split board-lock retention. RoHS compliant and designed for high-density SMT board-to-board connections. In stock worldwide with fast shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-130-03-L-D-LCOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
60
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Tiger Eye contact design with gold (15 µin) over nickel (50 µin) mating finish provides low, stable contact resistance and high mating-cycle durability in dense 0.050" pitch assemblies
  • Split board-lock retention feature mechanically anchors the connector to the PCB, preventing pull-out under vibration or repeated mating without additional hardware
  • 60-position dual-row layout in a 1.625 inch body delivers high channel density for board-to-board signal routing in space-constrained SMT designs

Applications

The TFM-130-03-L-D-LC serves high-density board-to-board interconnects in embedded computing, telecommunications, and industrial automation where 60 signal channels must pass through a compact 0.050" pitch footprint. The split board-lock feature provides mechanical stability in vibration-prone environments such as industrial rack systems and vehicular electronics. Its RoHS-compliant construction meets environmental compliance requirements for global market deployment.

Specifications

YTEOL9.15
Additional FeatureROHS COMPLIANT
Board Mounting OptionSPLIT BOARD LOCK
Body Breadth0.225inch
Body Depth0.22inch
Body Length1.625inch
Body/Shell StyleRECEPTACLE
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (15) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting Option 1LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness10u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)5A
Reference StandardUL, CSA
Terminal Pitch1.27mm
Termination TypeSOLDER
Total Number of Contacts60
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TFM-130-03-L-D-LC Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact finish does the TFM-130-03-L-D-LC use, and how does it improve connector reliability?

The TFM-130-03-L-D-LC uses gold (15 µin) over nickel (50 µin) on the mating contacts. The 15 µin gold layer provides corrosion resistance and low contact resistance, while the 50 µin nickel barrier prevents gold diffusion into the base metal, extending reliable performance across hundreds of mating cycles in high-density 0.050" pitch SMT connectors.

What is the function of the split board-lock on TFM-130-03-L-D-LC and when is it critical?

The split board-lock feature mechanically clamps the 1.625 inch connector body to the PCB through split tines that grip the board edge. This retention is critical in applications subject to vibration or frequent connector mating, such as industrial automation panels and mobile embedded systems, where solder joints alone cannot maintain the required pull-out force over time.

For a 60-channel signal routing requirement at 0.050" pitch, how does TFM-130-03-L-D-LC fit into board layout?

The TFM-130-03-L-D-LC provides 60 positions in a dual-row 1.625 inch body at 0.050" (1.27 mm) pitch, occupying a modest board footprint compared to 0.100" alternatives at equivalent channel count. This compact layout is particularly valuable in mezzanine card and module stacking designs where lateral board space is constrained to under 2 inches.

Is the TFM-130-03-L-D-LC suitable for designs that must meet international environmental standards?

Yes, the TFM-130-03-L-D-LC is RoHS compliant, meaning it is manufactured without restricted hazardous substances such as lead and certain halogens. This compliance makes it suitable for products sold in the European Union and other markets with environmental restrictions, including consumer electronics, industrial equipment, and telecommunications infrastructure operating under RoHS directives.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

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