TFM-130-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-130-02-F-D is a high-reliability Tiger Eye dual-row board stacking connector on 1.27 mm (0.050 inch) pitch with 60 positions and gold flash mating contacts. Phosphor bronze contacts with tin-over-nickel solder termination deliver stable, low-resistance board-to-board connections. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFM-130-02-F-D Datasheet PDF
- Category
- Connector
- Price
- From $3.1191(MOQ 13)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-130-02-F-D?
- 1.27 mm (0.050 inch) pitch dual-row layout packs 60 positions into a 41.3 mm body for ultra-high-density board stacking
- Tiger Eye gold flash mating contacts provide robust wipe action and low contact resistance across thousands of mating cycles
- Phosphor bronze contact material with nickel barrier ensures reliable mechanical spring force and corrosion resistance
What is TFM-130-02-F-D used for?
The TFM-130-02-F-D is designed for high-density board stacking in compact embedded systems, mezzanine card architectures, and high-reliability aerospace and defense electronics. Its 1.27 mm pitch and 60-position dual-row configuration maximize signal count within a minimal PCB footprint, supporting both high-speed digital and mixed-signal interfaces. The gold flash contact finish and phosphor bronze construction meet demanding cycle-life and environmental requirements in rugged deployments.
What are the specifications of TFM-130-02-F-D?
| Pbfree Code | Yes |
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Length | 1.625inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD FLASH |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Where can I find the TFM-130-02-F-D datasheet?
TFM-130-02-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-130-02-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What pitch and position count does the TFM-130-02-F-D offer for board stacking?
The TFM-130-02-F-D uses a 1.27 mm (0.050 inch) pitch with 60 total positions in a dual-row, 30-per-row layout. The body measures 1.625 inches (41.3 mm) in length and 0.225 inches (5.72 mm) in breadth, enabling dense interconnection in mezzanine and daughter-card designs with limited board area.
Why does TFM-130-02-F-D use gold flash on mating contacts instead of full gold plating?
Gold flash (typically 0.05 µm to 0.15 µm Au) provides a corrosion-resistant mating surface at lower cost than heavy gold plating. For board stacking applications with moderate insertion cycles, gold flash over the Tiger Eye contact geometry delivers contact resistance below 20 mΩ while reducing precious metal cost compared to 0.76 µm or thicker hard gold finishes used in high-cycle connectors.
In which rugged or high-reliability environments is TFM-130-02-F-D well suited?
The TFM-130-02-F-D's phosphor bronze contacts with nickel barrier and gold flash finish tolerate operating temperatures from -55°C to +125°C as specified for SAMTEC Tiger Eye series, making it appropriate for military-grade electronics, avionics, and industrial automation controllers where thermal cycling and vibration resistance are critical.
How does the 0.050 inch pitch of TFM-130-02-F-D compare to standard 0.100 inch pitch headers for space-constrained designs?
At 1.27 mm pitch, TFM-130-02-F-D achieves twice the signal density per millimeter of board edge compared to 2.54 mm pitch headers. A 60-position dual-row 1.27 mm connector occupies roughly half the length of an equivalent-count 2.54 mm part, saving approximately 20 mm of board real estate in high-density modules such as FPGA mezzanine cards and SOM carrier boards.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 13+ | $5.5023 | $71.53 |
| 50+ | $4.9800 | $249.00 |
| 100+ | $4.5300 | $453.00 |
| 500+ | $3.7229 | $1861.44 |
| 1000+ | $3.4691 | $3469.05 |
| 2000+ | $3.1191 | $6238.10 |
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
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