TFM-130-02-F-D SAMTEC Connector (Other) In Stock

SAMTEC TFM-130-02-F-D is a high-reliability Tiger Eye dual-row board stacking connector on 1.27 mm (0.050 inch) pitch with 60 positions and gold flash mating contacts. Phosphor bronze contacts with tin-over-nickel solder termination deliver stable, low-resistance board-to-board connections. Available from stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-130-02-F-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
60
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 1.27 mm (0.050 inch) pitch dual-row layout packs 60 positions into a 41.3 mm body for ultra-high-density board stacking
  • Tiger Eye gold flash mating contacts provide robust wipe action and low contact resistance across thousands of mating cycles
  • Phosphor bronze contact material with nickel barrier ensures reliable mechanical spring force and corrosion resistance

Applications

The TFM-130-02-F-D is designed for high-density board stacking in compact embedded systems, mezzanine card architectures, and high-reliability aerospace and defense electronics. Its 1.27 mm pitch and 60-position dual-row configuration maximize signal count within a minimal PCB footprint, supporting both high-speed digital and mixed-signal interfaces. The gold flash contact finish and phosphor bronze construction meet demanding cycle-life and environmental requirements in rugged deployments.

Specifications

Pbfree CodeYes
YTEOL8.75
Body Breadth0.225inch
Body Length1.625inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingGOLD FLASH
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting Option 1GUIDE SLOT
Mounting Option 2LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness3u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)3.2A
Reference StandardUL, CSA
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts60
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TFM-130-02-F-D Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pitch and position count does the TFM-130-02-F-D offer for board stacking?

The TFM-130-02-F-D uses a 1.27 mm (0.050 inch) pitch with 60 total positions in a dual-row, 30-per-row layout. The body measures 1.625 inches (41.3 mm) in length and 0.225 inches (5.72 mm) in breadth, enabling dense interconnection in mezzanine and daughter-card designs with limited board area.

Why does TFM-130-02-F-D use gold flash on mating contacts instead of full gold plating?

Gold flash (typically 0.05 µm to 0.15 µm Au) provides a corrosion-resistant mating surface at lower cost than heavy gold plating. For board stacking applications with moderate insertion cycles, gold flash over the Tiger Eye contact geometry delivers contact resistance below 20 mΩ while reducing precious metal cost compared to 0.76 µm or thicker hard gold finishes used in high-cycle connectors.

In which rugged or high-reliability environments is TFM-130-02-F-D well suited?

The TFM-130-02-F-D's phosphor bronze contacts with nickel barrier and gold flash finish tolerate operating temperatures from -55°C to +125°C as specified for SAMTEC Tiger Eye series, making it appropriate for military-grade electronics, avionics, and industrial automation controllers where thermal cycling and vibration resistance are critical.

How does the 0.050 inch pitch of TFM-130-02-F-D compare to standard 0.100 inch pitch headers for space-constrained designs?

At 1.27 mm pitch, TFM-130-02-F-D achieves twice the signal density per millimeter of board edge compared to 2.54 mm pitch headers. A 60-position dual-row 1.27 mm connector occupies roughly half the length of an equivalent-count 2.54 mm part, saving approximately 20 mm of board real estate in high-density modules such as FPGA mezzanine cards and SOM carrier boards.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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