TFM-130-01-L-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-130-01-L-D-A-P-TR is a high-reliability Tiger Eye terminal strip at 0.050 inch (1.27 mm) pitch with a dual-row, 30-position-per-row, low-profile SMT configuration in tape-and-reel packaging. It provides 60 total contacts with anti-rotation pegs for automated assembly on HDI PCBs. Available from authorized distributors with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFM-130-01-L-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-130-01-L-D-A-P-TR?
- 30-position dual-row Tiger Eye terminal strip at 0.050 inch pitch offering 60 total contacts in tape-and-reel packaging for high-volume SMT production
- Anti-rotation peg (P suffix) mechanically locks the connector to the PCB, maintaining alignment through 260 °C lead-free reflow profiles
- Low-profile (L) height minimizes board stack thickness while Tiger Eye redundant contacts maintain resistance below 20 milliohms
What is TFM-130-01-L-D-A-P-TR used for?
The TFM-130-01-L-D-A-P-TR is designed for high-volume automated SMT production of dense multi-layer PCBs used in aerospace avionics, high-speed data acquisition, and embedded computing platforms. Its 60-contact, 0.050 inch pitch dual-row layout connects FPGA daughter cards, memory modules, or analog front-end boards within tight mechanical envelopes. The tape-and-reel format and anti-rotation peg support reliable pick-and-place placement and dimensional stability during reflow, reducing costly rework on premium HDI assemblies.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFM-130-01-L-D-A-P-TR datasheet?
TFM-130-01-L-D-A-P-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-130-01-L-D-A-P-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What total contact count and pitch does TFM-130-01-L-D-A-P-TR provide, and how does that support complex multi-signal board interfaces?
The TFM-130-01-L-D-A-P-TR delivers 60 total contacts in 2 rows of 30 positions at 0.050 inch (1.27 mm) pitch. This supports full 32-bit parallel data buses with separate address, interrupt, power, and ground lines on a single connector body, enabling compact multi-signal daughter card interfaces in embedded processors, FPGAs, and DSP development platforms.
How does the L (low-profile) suffix affect the installed height of TFM-130-01-L-D-A-P-TR in a stacked-board assembly?
The low-profile (L) variant of the TFM-130-01-L-D-A-P-TR reduces the connector's standing height above the PCB surface compared to standard and high-profile alternatives. This typically constrains the mated stack height to approximately 4 mm to 6 mm, allowing two PCBs to be positioned closer together in rugged enclosures, satellite sub-systems, or portable military electronics where board-to-board clearance is a hard design constraint.
For automated assembly, how does the tape-and-reel (TR) packaging of TFM-130-01-L-D-A-P-TR improve production throughput?
Tape-and-reel packaging feeds the TFM-130-01-L-D-A-P-TR directly into automated pick-and-place machines without manual singulation or orientation. At a 0.050 inch pitch with 60 contacts, precise feeder alignment reduces placement error to under 0.1 mm, and continuous reel supply cuts connector changeover time, enabling assembly lines to process thousands of boards per shift without interruption for a 60-pin high-density interconnect.
When is TFM-130-01-L-D-A-P-TR a better procurement choice than a surface-mount connector using 0.100 inch pitch for the same 60-signal interface?
Choosing TFM-130-01-L-D-A-P-TR at 0.050 inch pitch roughly halves the PCB footprint relative to a 0.100 inch pitch 60-contact connector, saving approximately 19 mm of board length along the contact row. This space efficiency is critical when board dimensions are fixed below 100 mm x 100 mm, as in CubeSat modules, wearable electronics, or compact industrial SoM boards where every square millimeter of PCB area has a direct cost impact.
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