TFM-120-12-S-D-A-P-TR SAMTEC Connector (Other) In Stock

SAMTEC TFM-120-12-S-D-A-P-TR is a 20-position dual-row Tiger Eye SMT terminal strip at 0.050-inch pitch with gold-over-nickel mating contacts, measuring 1.125 x 0.29 x 0.225 inch. It comes in tape-and-reel format for high-volume SMT assembly. From $6.00 in stock with worldwide shipping.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-120-12-S-D-A-P-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
40
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 20-position dual-row 0.050-inch pitch SMT terminal strip with gold-over-nickel mating contacts for ultra-reliable low-resistance board interfaces
  • Peg board-mount retention system stabilizes connector during SMT reflow soldering, ensuring precise alignment of 40 total contacts
  • Tape-and-reel (-TR) packaging with tin-nickel barrier termination supports automated pick-and-place assembly at 0.050-inch pitch

Applications

The TFM-120-12-S-D-A-P-TR is designed for high-reliability SMT board-to-board signal connections in defense electronics, aerospace modules, and high-density industrial PCB assemblies at 0.050-inch pitch. Its gold-over-nickel mating contacts ensure stable electrical performance through numerous mating cycles, while the peg retention system eliminates movement during reflow soldering. The tape-and-reel packaging makes it suitable for automated production assembly in volume manufacturing of compact embedded systems.

Specifications

Pbfree CodeYes
Factory Lead Time6Weeks
YTEOL9.4
Board Mounting OptionPEG
Body Breadth0.225inch
Body Depth0.29inch
Body Length1.125inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD OVER NICKEL
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.429mm
Rated Current (Signal)3.2A
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts40
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, Vietnam

Datasheet

TFM-120-12-S-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

Why does TFM-120-12-S-D-A-P-TR use gold-over-nickel mating contacts instead of standard tin plating for board-to-board interfaces?

The TFM-120-12-S-D-A-P-TR uses gold-over-nickel mating contacts to ensure the lowest and most stable contact resistance across all 40 positions, particularly for low-signal-level analog and digital interfaces. Gold does not form an oxide layer, unlike tin, which means contact resistance remains consistently low after thousands of mating cycles. The nickel underplate acts as a diffusion barrier, preventing gold from migrating into the base copper contact material over time.

How does the peg board-mount option on TFM-120-12-S-D-A-P-TR help during SMT reflow soldering of a 0.050-inch pitch connector?

The peg board-mount feature on TFM-120-12-S-D-A-P-TR physically locates and stabilizes the connector on the PCB during the SMT reflow soldering process, preventing lateral movement caused by paste tack variation or conveyor vibration. This is especially important at 0.050-inch (1.27 mm) pitch where even a 0.1 mm shift can cause solder bridging between adjacent pads. The peg engagement also holds the connector body at the correct standoff height while solder joints solidify.

For a compact avionics board needing 40 signals at 0.050-inch pitch, how does TFM-120-12-S-D-A-P-TR fit within a tight PCB envelope?

The TFM-120-12-S-D-A-P-TR body measures only 1.125 inches in length, 0.29 inches in depth, and 0.225 inches in breadth, accommodating 40 contacts in a dual-row 20-position 0.050-inch pitch footprint. This compact envelope is suitable for avionics boards and military electronics modules where high pin-count interfaces must fit within a limited PCB area. The 9.4-year YTEOL rating also ensures long-term supply continuity for defense and aerospace programs with extended production lifecycles.

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About SAMTEC

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AvailabilityIn Stock
Reference Price (USD)
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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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