TFM-120-12-S-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-120-12-S-D-A-P-TR is a 20-position dual-row Tiger Eye SMT terminal strip at 0.050-inch pitch with gold-over-nickel mating contacts, measuring 1.125 x 0.29 x 0.225 inch. It comes in tape-and-reel format for high-volume SMT assembly. From $6.00 in stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFM-120-12-S-D-A-P-TR Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 20-position dual-row 0.050-inch pitch SMT terminal strip with gold-over-nickel mating contacts for ultra-reliable low-resistance board interfaces
- Peg board-mount retention system stabilizes connector during SMT reflow soldering, ensuring precise alignment of 40 total contacts
- Tape-and-reel (-TR) packaging with tin-nickel barrier termination supports automated pick-and-place assembly at 0.050-inch pitch
Applications
The TFM-120-12-S-D-A-P-TR is designed for high-reliability SMT board-to-board signal connections in defense electronics, aerospace modules, and high-density industrial PCB assemblies at 0.050-inch pitch. Its gold-over-nickel mating contacts ensure stable electrical performance through numerous mating cycles, while the peg retention system eliminates movement during reflow soldering. The tape-and-reel packaging makes it suitable for automated production assembly in volume manufacturing of compact embedded systems.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 6Weeks |
| YTEOL | 9.4 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.29inch |
| Body Length | 1.125inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.429mm |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
Why does TFM-120-12-S-D-A-P-TR use gold-over-nickel mating contacts instead of standard tin plating for board-to-board interfaces?
The TFM-120-12-S-D-A-P-TR uses gold-over-nickel mating contacts to ensure the lowest and most stable contact resistance across all 40 positions, particularly for low-signal-level analog and digital interfaces. Gold does not form an oxide layer, unlike tin, which means contact resistance remains consistently low after thousands of mating cycles. The nickel underplate acts as a diffusion barrier, preventing gold from migrating into the base copper contact material over time.
How does the peg board-mount option on TFM-120-12-S-D-A-P-TR help during SMT reflow soldering of a 0.050-inch pitch connector?
The peg board-mount feature on TFM-120-12-S-D-A-P-TR physically locates and stabilizes the connector on the PCB during the SMT reflow soldering process, preventing lateral movement caused by paste tack variation or conveyor vibration. This is especially important at 0.050-inch (1.27 mm) pitch where even a 0.1 mm shift can cause solder bridging between adjacent pads. The peg engagement also holds the connector body at the correct standoff height while solder joints solidify.
For a compact avionics board needing 40 signals at 0.050-inch pitch, how does TFM-120-12-S-D-A-P-TR fit within a tight PCB envelope?
The TFM-120-12-S-D-A-P-TR body measures only 1.125 inches in length, 0.29 inches in depth, and 0.225 inches in breadth, accommodating 40 contacts in a dual-row 20-position 0.050-inch pitch footprint. This compact envelope is suitable for avionics boards and military electronics modules where high pin-count interfaces must fit within a limited PCB area. The 9.4-year YTEOL rating also ensures long-term supply continuity for defense and aerospace programs with extended production lifecycles.
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