TFM-120-01-F-D-A-P-TR SAMTEC Connector (Other) In Stock
SAMTEC TFM-120-01-F-D-A-P-TR is a Tiger Eye terminal strip connector with 0.050 inch pitch, dual-row, 40 positions total, offering high-reliability surface-mount termination. Available from SAMTEC with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFM-120-01-F-D-A-P-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 0.050" (1.27 mm) pitch dual-row Tiger Eye terminal strip for high-density board-to-board connections
- Surface-mount tape-and-reel packaging (TR suffix) supports automated pick-and-place assembly
- High-reliability contact design withstands repeated mating cycles with consistent low contact resistance
Applications
The TFM-120-01-F-D-A-P-TR is suited for high-density board-to-board and board-to-cable interconnect applications where space is at a premium. Its 0.050 inch pitch and dual-row layout make it ideal for compact instrumentation, communications modules, and embedded computing boards requiring reliable signal integrity in tight layouts.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the contact pitch of the TFM-120-01-F-D-A-P-TR and how does it affect board density?
The TFM-120-01-F-D-A-P-TR uses a 0.050 inch (1.27 mm) pitch, which allows a high-density dual-row layout with 40 total pins in a compact footprint, making it suitable for space-constrained PCB designs in instrumentation and embedded systems.
Which assembly process is supported by the TFM-120-01-F-D-A-P-TR packaging format?
The TR suffix indicates tape-and-reel packaging, which supports automated surface-mount assembly lines. The component accommodates standard SMT pick-and-place equipment with reflow soldering at typical lead-free reflow temperatures around 260°C peak.
When would TFM-120-01-F-D-A-P-TR be preferred over a through-hole terminal strip for a backplane design?
When board thickness, automated assembly throughput, or a low-profile SMT stack-up is required, the TFM-120-01-F-D-A-P-TR is preferred. Its surface-mount footprint eliminates the need for drilling 40 holes, reducing PCB fabrication cost and enabling double-sided component placement in compact backplane or mezzanine card designs.
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