TFM-115-12-S-D-LC SAMTEC Connector (Other) In Stock
TFM-115-12-S-D-LC is a 30-position dual-row SAMTEC Tiger Eye high-reliability surface-mount terminal strip with 1.27 mm (0.050 inch) pitch and vertical orientation. Features gold (30 µin) over nickel (50 µin) contact finish and split board-lock for secure PCB retention. In stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-12-S-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Tiger Eye high-reliability contact design with gold (30 µin) over nickel (50 µin) finish for low-resistance, high-cycle mating
- 1.27 mm (0.050 inch) pitch in a 30-position dual-row surface-mount footprint maximizes signal density in compact PCB layouts
- Split board-lock mounting option provides positive mechanical retention to the PCB, reducing connector movement under vibration
Applications
TFM-115-12-S-D-LC is used in high-density board-to-board and mezzanine interconnect applications in aerospace, defense, and medical equipment where a reliable 30-position dual-row SMT connector with fine 0.050 inch pitch is required. Its Tiger Eye contact design ensures consistent signal integrity across hundreds of mating cycles in test fixtures and modular embedded computing stacks. The connector is also deployed in FMC (FPGA Mezzanine Card) and VITA standards-compatible modules requiring dense, low-profile SMT interconnects.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 10Weeks |
| YTEOL | 9.4 |
| Additional Feature | NONE |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.295inch |
| Body Length | 0.875inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | SHRD ENDS |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact finish specification does TFM-115-12-S-D-LC use, and why is it important for high-reliability applications?
TFM-115-12-S-D-LC uses gold (30 microinch) over nickel (50 microinch) on mating contacts, which is thicker than standard 10 µin gold plating. The heavier gold deposit resists fretting corrosion and wear over hundreds of mating cycles, maintaining contact resistance below 20 milliohms in demanding aerospace, defense, and medical applications where connector failure is not acceptable.
How does the 1.27 mm pitch of TFM-115-12-S-D-LC enable higher signal density than standard 2.54 mm pitch connectors?
At 1.27 mm (0.050 inch) pitch, TFM-115-12-S-D-LC fits twice as many contacts per unit length as a 2.54 mm pitch connector. For the 30-position dual-row configuration, this results in a body length of only 0.875 inch (22.2 mm), enabling significantly higher connector density on constrained PCBs such as FPGA mezzanine cards and compact embedded modules.
What does the split board-lock feature on TFM-115-12-S-D-LC provide compared to connectors without board locks?
The split board-lock on TFM-115-12-S-D-LC snaps into matching PCB holes, creating a mechanical anchor that resists the connector being pulled off the board during mating force application or vibration. This prevents solder-joint stress fractures in high-vibration environments such as avionics or industrial machinery, where a connector without mechanical retention could shift and cause intermittent opens.
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