TFM-115-12-S-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-115-12-S-D is a 30-position dual-row high-reliability Tiger Eye shrouded receptacle with 1.27 mm (0.050 inch) pitch and gold (30 µin) over nickel (50 µin) mating contacts. Features ELP extended-life plating, shrouded housing for keyed mating, and matte tin termination. Available in stock worldwide with approximately 4-week lead time.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-12-S-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Gold (30 µin) over nickel (50 µin) ELP mating contacts rated for 500+ insertion cycles for high-reliability board interconnect
- Shrouded Tiger Eye receptacle design prevents connector misalignment, ensuring correct 30-position dual-row 1.27 mm pitch mating every time
- Matte tin (Sn) with nickel (Ni) barrier termination provides excellent solderability for RoHS-compliant lead-free reflow at 260°C
Applications
The TFM-115-12-S-D is designed for high-reliability board-to-board interconnect in aerospace, defense, medical instrumentation, and industrial automation where 500 or more mating cycles are expected. Its shrouded 30-position dual-row 1.27 mm pitch receptacle is ideal for FPGA daughter-card connections, rugged embedded module interfaces, and signal-dense backplane applications requiring gold-plated high-cycle contacts.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 3 Weeks, 5 Days |
| YTEOL | 9.4 |
| Additional Feature | ELP; TIGER EYE, SHROUDED |
| Body Breadth | 0.225inch |
| Body Length | 0.875inch |
| Body/Shell Style | RECEPTACLE |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How do the gold (30 µin) ELP contacts on TFM-115-12-S-D extend connector service life compared to standard gold plating?
Standard SAMTEC contacts use 10 µin gold, while TFM-115-12-S-D's ELP (Extended Life Plating) deposits 30 µin gold over 50 µin nickel. This tripled gold thickness maintains contact resistance below 20 mΩ for 500 or more insertion cycles, making TFM-115-12-S-D the preferred choice in maintenance-intensive or field-replaceable module designs.
What position count and board footprint does TFM-115-12-S-D occupy for high-density PCB routing?
TFM-115-12-S-D provides 30 positions in a dual-row 1.27 mm pitch configuration with a body length of 0.875 inch (22.2 mm) and breadth of 0.225 inch (5.7 mm), fitting approximately 3 connectors end-to-end in a 70 mm board span while routing 30 signal channels through a narrow 5.7 mm wide footprint.
For aerospace or defense module designs, why is TFM-115-12-S-D preferred over lower-reliability alternatives?
In defense and aerospace applications subjected to vibration, thermal cycling from -55°C to +125°C, and frequent module removal, TFM-115-12-S-D's 30 µin gold ELP contacts, shrouded housing, and nickel barrier termination provide the contact integrity and misalignment protection that standard 10 µin gold connectors cannot sustain over a system's 10- to 20-year service life.
Related Guides
How to Choose a Digital Potentiometer: AD5204, AD5206, and AD8403 Selection Guide
Compare the AD5204, AD5206, and AD8403 multi-channel SPI digipots by channel count, resistance value, and package to choose the right Analog Devices digital potentiometer for your design.
Jun 21, 2026
AD7745 / AD7746 / AD7747 Capacitance-to-Digital Converter Design Guide
Complete application note for the AD774x CDC family: circuit design, shielding, conversion rate selection, and sourcing guidance for the AD7745, AD7746, and AD7747.
Jun 21, 2026
ECMF02-4CMX8 Common-Mode Filter with ESD Protection: Selection Guide
Compare ECMF02-4CMX8 vs ECMF02-2AMX6, ECMF04-4HSM10, and other ST ECMF filters. Choose the right 4-channel common-mode filter with ESD protection for USB 2.0.
Jun 20, 2026
AD5204 Quad Digital Potentiometer Selection Guide (2026)
How to choose the right AD5204 quad digital potentiometer: compare 10kΩ vs 100kΩ variants, TSSOP vs SOIC packages, and SPI interface options for your design.
Jun 20, 2026
Why Buy from FindMyChip
About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
In Stock · 24h Response · Worldwide Shipping
Response within 24 hours · Worldwide shipping
“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”