TFM-115-02-S-D-LC SAMTEC Connector (Other) In Stock
TFM-115-02-S-D-LC is a 30-position dual-row high-reliability Tiger Eye SMT terminal strip from SAMTEC on 1.27 mm (0.050 inch) pitch with 30 µin gold over nickel contacts. It uses a split board lock and vertical surface-mount orientation for secure mezzanine card interconnect.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-02-S-D-LC Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position dual-row layout on 1.27 mm pitch delivering high signal density in a 0.875 x 0.225 inch SMT footprint
- 30 µin gold over 50 µin nickel contact plating ensuring low contact resistance and extended mating cycle reliability
- Split board lock retention feature preventing accidental unmating under vibration or mechanical shock
- Tiger Eye high-reliability socket design rated for 100+ mating cycles in demanding aerospace and industrial applications
- Vertical SMT orientation enabling straight-through signal routing from mezzanine to carrier board without angle adapters
Applications
The TFM-115-02-S-D-LC is used in high-reliability mezzanine interconnect applications such as FPGA daughter cards, avionics I/O modules, and instrumentation plug-in boards where 30 signals must be routed at 1.27 mm pitch with mechanical retention. Its split board lock prevents accidental disconnection in vibration-prone environments such as aerospace platforms and industrial robots. The gold-plated Tiger Eye contacts also suit test and measurement fixtures where repeatable low-resistance connections across hundreds of mating cycles are essential.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 9.4 |
| Additional Feature | NONE |
| Board Mounting Option | SPLIT BOARD LOCK |
| Body Breadth | 0.225inch |
| Body Depth | 0.225inch |
| Body Length | 0.875inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | SHRD ENDS |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | USA, Vietnam |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact plating specification does the TFM-115-02-S-D-LC use and how does it affect contact resistance over repeated mating cycles?
The TFM-115-02-S-D-LC contacts are plated with 30 µin gold over 50 µin nickel, which maintains contact resistance well below 30 mΩ over a minimum of 100 mating cycles. The thick gold layer resists fretting corrosion and oxidation that would otherwise increase resistance in high-cycle applications such as test fixtures, field-replaceable modules, or avionics line-replaceable units that undergo regular maintenance swaps.
How does the split board lock on the TFM-115-02-S-D-LC improve retention in vibration-prone designs?
The split board lock is a pair of solder-in retention pegs positioned at each end of the 0.875 inch connector body that anchor the housing to the PCB copper pads mechanically, independent of the 30 signal contacts. Under vibration profiles such as IEC 60068-2-6 or MIL-STD-810 random vibration, the board locks transfer lateral and axial shock forces into the PCB substrate rather than into the 1.27 mm pitch signal solder joints, preventing connector walking or intermittent contact.
What PCB footprint dimensions does the TFM-115-02-S-D-LC require for the 30-position dual-row layout?
The TFM-115-02-S-D-LC body measures 0.875 x 0.225 inches (approximately 22.2 x 5.7 mm) and the dual-row 1.27 mm pitch pad array occupies a land area of roughly 22 x 4 mm with 15 pads per row at 1.27 mm spacing. The split board locks add two additional solder pads at each end, so the overall PCB keep-out zone including the locks extends to approximately 25 mm in length, which must be reserved on both the mezzanine and carrier board in the stack-up.
When is the TFM-115-02-S-D-LC preferred over a lower-cost tin-plated alternative for a 30-pin board-to-board application?
The TFM-115-02-S-D-LC is preferred over tin-plated alternatives when mating cycle count exceeds 30, operating temperature range spans -55°C to +125°C, or the connector is used in environments with humidity above 85% RH where tin oxidizes and raises contact resistance above acceptable thresholds. For commercial designs with fewer than 20 mating cycles in a controlled 0°C to 70°C environment, a tin-plated strip at lower unit cost may be sufficient, but aerospace and industrial grades default to the gold plating for margin.
How does the 1.27 mm pitch of the TFM-115-02-S-D-LC benefit compact mezzanine stacking designs compared to 2.54 mm pitch connectors?
At 1.27 mm pitch the TFM-115-02-S-D-LC provides 30 positions in a dual-row strip spanning only 22.2 mm, whereas an equivalent 2.54 mm pitch connector would span 44.4 mm — doubling the board edge consumed. This halved footprint is critical in compact mezzanine stacks such as COM Express Type 6 modules, 3U VPX cards, and custom avionics form factors where every millimeter of edge length is shared among power, signal, and RF connectors.
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