TFM-115-02-L-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-115-02-L-D is a 30-position dual-row male board stacking connector with 0.050-inch pitch, gold-over-nickel mating contacts, and tin-over-nickel termination for reliable SMT board-to-board connections. Compact 0.875-inch body length suits high-density mezzanine stacking in communications and embedded computing designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-02-L-D Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- Dual-row 30-position male board stacking connector with 0.050" (1.27 mm) pitch for high-density interconnect
- Gold-over-nickel mating contacts for low contact resistance and extended mating cycle life
- Tin-over-nickel termination finish compatible with standard SMT reflow soldering processes
- Compact body profile (0.875" × 0.225") enables tight board-to-board stack height in mezzanine assemblies
Applications
The TFM-115-02-L-D is used in high-density board-to-board and mezzanine stacking applications in communications infrastructure, embedded computing modules, and test-and-measurement equipment. Its 30-position dual-row configuration at 0.050-inch pitch supports high signal counts in constrained PCB footprints. The gold-over-nickel contact finish ensures reliable electrical performance across repeated mating cycles in demanding industrial and aerospace environments.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Depth | 0.22inch |
| Body Length | 0.875inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD OVER NICKEL |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 15u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TFM-115-02-L-D board stacking connector support?
The TFM-115-02-L-D provides 30 positions arranged in a dual-row layout with 0.050-inch (1.27 mm) pitch. This high-density configuration supports 15 pairs of signals per row, making it suitable for board-to-board stacking applications where both signal count and compact PCB footprint are critical design requirements.
What contact finish does the TFM-115-02-L-D use, and why does it matter for reliability?
The mating contacts are finished with gold over nickel, providing low and stable contact resistance well below 20 mΩ. Gold plating resists oxidation and corrosion, extending mating cycle life to 500 or more cycles. The termination contacts use tin over nickel, which is compatible with standard lead-free reflow soldering at temperatures up to 260 °C.
Which board-to-board stacking scenarios is the SAMTEC TFM-115-02-L-D designed for?
The TFM-115-02-L-D is designed for mezzanine stacking between two PCBs where a compact 0.875-inch body length and 0.050-inch pitch are required. Typical uses include communications line cards, FPGA daughter-board interfaces, and industrial computing modules where 30 dual-row positions must be accommodated within a footprint smaller than 1 inch × 0.25 inch.
Can the TFM-115-02-L-D be assembled using automated SMT pick-and-place processes?
Yes. The TFM-115-02-L-D uses a surface mount termination style with tin-over-nickel finish that is fully compatible with automated SMT pick-and-place and standard lead-free reflow soldering profiles. Its body dimensions of 0.875 inch × 0.22 inch × 0.225 inch are within the range handled by most industrial placement systems, supporting high-volume PCB assembly workflows.
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