TFM-115-02-L-D SAMTEC Connector (Other) In Stock

SAMTEC TFM-115-02-L-D is a 30-position dual-row male board stacking connector with 0.050-inch pitch, gold-over-nickel mating contacts, and tin-over-nickel termination for reliable SMT board-to-board connections. Compact 0.875-inch body length suits high-density mezzanine stacking in communications and embedded computing designs.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-115-02-L-DOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
30
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • Dual-row 30-position male board stacking connector with 0.050" (1.27 mm) pitch for high-density interconnect
  • Gold-over-nickel mating contacts for low contact resistance and extended mating cycle life
  • Tin-over-nickel termination finish compatible with standard SMT reflow soldering processes
  • Compact body profile (0.875" × 0.225") enables tight board-to-board stack height in mezzanine assemblies

Applications

The TFM-115-02-L-D is used in high-density board-to-board and mezzanine stacking applications in communications infrastructure, embedded computing modules, and test-and-measurement equipment. Its 30-position dual-row configuration at 0.050-inch pitch supports high signal counts in constrained PCB footprints. The gold-over-nickel contact finish ensures reliable electrical performance across repeated mating cycles in demanding industrial and aerospace environments.

Specifications

Pbfree CodeYes
Factory Lead Time1Week
YTEOL8.75
Body Breadth0.225inch
Body Depth0.22inch
Body Length0.875inch
Connector TypeBOARD STACKING CONNECTOR
Contact Finish MatingGOLD OVER NICKEL
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting Option 1GUIDE SLOT
Mounting Option 2LOCKING
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness15u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)3.2A
Reference StandardUL, CSA
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts30
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

TFM-115-02-L-D Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and what pitch does the TFM-115-02-L-D board stacking connector support?

The TFM-115-02-L-D provides 30 positions arranged in a dual-row layout with 0.050-inch (1.27 mm) pitch. This high-density configuration supports 15 pairs of signals per row, making it suitable for board-to-board stacking applications where both signal count and compact PCB footprint are critical design requirements.

What contact finish does the TFM-115-02-L-D use, and why does it matter for reliability?

The mating contacts are finished with gold over nickel, providing low and stable contact resistance well below 20 mΩ. Gold plating resists oxidation and corrosion, extending mating cycle life to 500 or more cycles. The termination contacts use tin over nickel, which is compatible with standard lead-free reflow soldering at temperatures up to 260 °C.

Which board-to-board stacking scenarios is the SAMTEC TFM-115-02-L-D designed for?

The TFM-115-02-L-D is designed for mezzanine stacking between two PCBs where a compact 0.875-inch body length and 0.050-inch pitch are required. Typical uses include communications line cards, FPGA daughter-board interfaces, and industrial computing modules where 30 dual-row positions must be accommodated within a footprint smaller than 1 inch × 0.25 inch.

Can the TFM-115-02-L-D be assembled using automated SMT pick-and-place processes?

Yes. The TFM-115-02-L-D uses a surface mount termination style with tin-over-nickel finish that is fully compatible with automated SMT pick-and-place and standard lead-free reflow soldering profiles. Its body dimensions of 0.875 inch × 0.22 inch × 0.225 inch are within the range handled by most industrial placement systems, supporting high-volume PCB assembly workflows.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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