TFM-115-01-S-D-RA SAMTEC Connector (Other) In Stock
The SAMTEC TFM-115-01-S-D-RA is a 30-position dual-row right-angle board stacking connector with 1.00 mm pitch, featuring 30 µin gold-over-nickel mating contacts and matte tin termination for reliable PCB-to-PCB interconnections. It is RoHS-compliant with a 1-week factory lead time and suits fine-pitch stacking applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 30
- Lifecycle
- ACTIVE
- Datasheet
- TFM-115-01-S-D-RA Datasheet PDF
- Category
- Connector
- Temp Range
- -65.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 30-position dual-row right-angle design at 1.00 mm pitch enabling fine-pitch board stacking and PCB-to-PCB interconnections
- 30 µin gold over 50 µin nickel mating contact finish delivering low contact resistance and extended mating cycle durability
- RoHS-compliant with matte tin termination and nickel barrier for reliable solder joint formation in automated SMT assembly
Applications
The TFM-115-01-S-D-RA is designed for board stacking applications in compact embedded systems, module-on-board designs, and daughter-card assemblies requiring fine-pitch 1.00 mm dual-row connectors. Its right-angle orientation suits edge-card configurations where cables exit horizontally from a stacked PCB assembly. The gold-over-nickel mating finish ensures reliable performance in high-cycle mating environments such as plug-in module systems.
Specifications
| Pbfree Code | Yes |
| Factory Lead Time | 1Week |
| YTEOL | 8.65 |
| Additional Feature | ROHS COMPLIANT |
| Body Breadth | 0.225inch |
| Body Depth | 0.22inch |
| Body Length | 0.875inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (30) OVER NICKEL (50) |
| Contact Finish Termination | Matte Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Dielectric Withstanding Voltage | 600VAC V |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 30u inch |
| Polarization Key | SHRD ENDS |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL |
| Terminal Length | 0.075inch |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 30 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
Compatible alternatives and drop-in replacements for TFM-115-01-S-D-RA:
suggested
Frequently Asked Questions
What pitch and position count does the TFM-115-01-S-D-RA board stacking connector provide?
The TFM-115-01-S-D-RA is a 30-position dual-row right-angle board stacking connector with a 1.00 mm pitch. This fine-pitch layout fits 30 contacts in a body length of 0.875 inch, making it ideal for compact PCB-to-PCB stacking applications in embedded modules and wireless communication boards.
What contact finish does TFM-115-01-S-D-RA use and how does it support reliable mating performance?
The TFM-115-01-S-D-RA uses 30 µin gold over 50 µin nickel on the mating contacts, providing excellent wear resistance and low contact resistance across multiple mating cycles. The matte tin with nickel barrier termination ensures reliable solder bonding during PCB assembly without oxidation issues.
How does TFM-115-01-S-D-RA compare to a vertical board stacking connector for space-constrained PCB designs?
The TFM-115-01-S-D-RA uses a right-angle (RA) orientation at 1.00 mm pitch, which routes signals horizontally from the board edge rather than vertically. This reduces stack height by approximately the board thickness plus connector height compared to vertical stacking alternatives, benefiting designs with tight z-axis clearance such as compact module assemblies.
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