TFM-110-32-F-D-A-P-TR SAMTEC Connector (Other) In Stock

Name: TFM-110-32-F-D-A-P-TR
Brand: SAMTEC
SKU: TFM-110-32-F-D-A-P-TR
Availability: InStock

SAMTEC TFM-110-32-F-D-A-P-TR is a high-reliability Tiger Eye terminal strip with 0.050 inch pitch, dual-row 20-pin board stacking connector with gold-plated contacts and phosphor bronze construction. Available from authorized distributors with worldwide shipping.

ACTIVEConnectorVerified Jun 2026

Package / Visual Reference

TFM-110-32-F-D-A-P-TROther

Quick Facts

Manufacturer: SAMTEC
Package: Other
Pin Count: 20
Lifecycle: ACTIVE
Datasheet: TFM-110-32-F-D-A-P-TR Datasheet PDF
Category: Connector
Price: From $1.8400(MOQ 1000)
Temp Range: -55.0°C to 125.0°C
RoHS: Compliant
Lead Time: 3–7 business days
Shipping: DHL Express · Worldwide

What are the key features of TFM-110-32-F-D-A-P-TR?

0.050" pitch dual-row board stacking connector with 20 positions per row for high-density signal routing
Gold-plated mating contacts over phosphor bronze construction ensuring reliable electrical performance across 8.75 year TEOL
Tape-and-reel (TR) packaging with press-fit retention peg for automated SMT assembly and secure board mounting

What is TFM-110-32-F-D-A-P-TR used for?

The TFM-110-32-F-D-A-P-TR is well-suited for board-to-board stacking applications in industrial control systems, communications equipment, and embedded computing platforms requiring high-density signal interconnects. Its 0.050 inch pitch and dual-row configuration make it ideal for compact PCB designs where space is at a premium. The tape-and-reel packaging supports high-volume automated assembly for telecommunications and data center hardware.

What are the specifications of TFM-110-32-F-D-A-P-TR?

YTEOL	8.75
Body Breadth	0.225inch
Body Depth	0.435inch
Body Length	0.625inch
Connector Type	BOARD STACKING CONNECTOR
Contact Finish Mating	GOLD (3)
Contact Finish Termination	Matte Tin (Sn)
Contact Gender	MALE
Contact Material	PHOSPHOR BRONZE
Contact Pattern	RECTANGULAR
Contact Style	SQ PIN-SKT
Filter Feature	NO
Insulator Color	BLACK
Insulator Material	LIQUID CRYSTAL POLYMER
JESD-609 Code	e3
Mating Contact Pitch	0.05inch
Mating Contact Row Spacing	0.05inch
Mating Information	MULTIPAL MATING PARTS AVAILBLE
Mixed Contacts	NO
Mounting Option 1	LOCKING
Mounting Style	STRAIGHT
Mounting Type	BOARD
Number Of Connectors	ONE
Number Of PCB Rows	2
Number of Rows Loaded	2
Option	GENERAL PURPOSE
PCB Contact Pattern	RECTANGULAR
PCB Contact Row Spacing	4.32mm
Plating Thickness	3u inch
Polarization Key	POLARIZED HOUSING
Rated Current (Signal)	3.7A
Reference Standard	UL
Terminal Pitch	1.27mm
Termination Type	SURFACE MOUNT
Total Number of Contacts	20
UL Flammability Code	94V-0
Withdrawl Force-Min	3.336N
Package	Other

Compliance & Regulatory

RoHS Status	Compliant
Lead-Free	Yes (Pb-Free)
ECCN	EAR99
HTS Code	8536.69.40.40

Where can I find the TFM-110-32-F-D-A-P-TR datasheet?

TFM-110-32-F-D-A-P-TR Datasheet Download

Official datasheet from SAMTEC

What are equivalent replacements for TFM-110-32-F-D-A-P-TR?

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What pitch and row configuration does the TFM-110-32-F-D-A-P-TR feature?

The TFM-110-32-F-D-A-P-TR uses a 0.050 inch (1.27 mm) pitch dual-row configuration with 10 positions per row, giving 20 total contacts for high-density board stacking. This compact pitch supports dense PCB layouts used in communications and industrial control designs.

Which automated assembly processes are compatible with the TFM-110-32-F-D-A-P-TR tape-and-reel packaging?

The TR suffix indicates tape-and-reel packaging, making the TFM-110-32-F-D-A-P-TR directly compatible with standard pick-and-place SMT assembly equipment. The press-fit retention peg helps hold the connector in place during reflow soldering at temperatures typically up to 260°C, reducing misalignment in high-volume production runs.

How does the gold-plated mating contact finish on the TFM-110-32-F-D-A-P-TR compare to standard tin finishes for reliability?

Gold (3 micro-inch minimum) mating contacts on the TFM-110-32-F-D-A-P-TR provide lower and more stable contact resistance compared to matte tin termination finishes, with a rated TEOL of 8.75 years for long-life deployments. Gold resists oxidation across a wide operating temperature range, reducing intermittent connection failures in telecom and industrial environments where tin whiskers can be a concern.

What are the key body dimensions of the TFM-110-32-F-D-A-P-TR for PCB footprint planning?

The TFM-110-32-F-D-A-P-TR body measures 0.625 inch in length, 0.225 inch in breadth, and 0.435 inch in depth, supporting compact 0.050 inch pitch board stacking layouts. These dimensions are critical for PCB footprint design and clearance planning in high-density embedded systems.

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AvailabilityIn Stock

Reference Price (USD)

From $1.8400

Buy from 1pc · Factory-direct pricing

Qty.	Unit Price	Ext. Price
1000+	$2.8600	$2860.00
2500+	$2.3500	$5875.00
5000+	$1.8400	$9200.00

pcs

Unit price: $2.8600 · Total: $2860.00

In Stock · 24h Response · Worldwide Shipping

Direct Contact

WhatsApp Inquiry Email RFQ

Lead Time3-7 business days

MOQFrom 1 piece

ShippingDHL / FedEx / UPS

OriginChina (Authorized)

Response within 24 hours · Worldwide shipping

“Response time is incredible — usually under 4 hours. They understand that production lines can't wait.”

James Wright

Supply Chain Director, CircuitPro Ltd, UK

TFM-110-32-F-D-A-P-TR SAMTEC Connector (Other) In Stock

What are the key features of TFM-110-32-F-D-A-P-TR?

What is TFM-110-32-F-D-A-P-TR used for?

What are the specifications of TFM-110-32-F-D-A-P-TR?

Compliance & Regulatory

Where can I find the TFM-110-32-F-D-A-P-TR datasheet?

What are equivalent replacements for TFM-110-32-F-D-A-P-TR?

Frequently Asked Questions

What pitch and row configuration does the TFM-110-32-F-D-A-P-TR feature?

Which automated assembly processes are compatible with the TFM-110-32-F-D-A-P-TR tape-and-reel packaging?

How does the gold-plated mating contact finish on the TFM-110-32-F-D-A-P-TR compare to standard tin finishes for reliability?

What are the key body dimensions of the TFM-110-32-F-D-A-P-TR for PCB footprint planning?

Related Guides

STM32H753VIT6 High-Performance MCU Design Guide

STM32H753ZIT6 Selection Guide for High-Performance Embedded Systems

ICL7660ACPAZ Negative Voltage Charge Pump Design Guide

C0402C103K3RACTU 10 nF MLCC Design Guide

Why Buy from FindMyChip

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