TFM-108-02-F-D SAMTEC Connector (Other) In Stock
SAMTEC TFM-108-02-F-D is a 16-position dual-row Tiger Eye high-reliability terminal strip with 0.050" (1.27 mm) pitch, gold-on-nickel mating contacts, and board-stacking rectangular contact pattern. Built for demanding signal integrity applications requiring positive retention. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 16
- Lifecycle
- ACTIVE
- Datasheet
- TFM-108-02-F-D Datasheet PDF
- Category
- Connector
- Price
- From $0.9849(MOQ 42)
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFM-108-02-F-D?
- Tiger Eye high-reliability contact system with gold-on-nickel (Au on Ni) mating finish for low contact resistance across 16 positions
- 0.050" (1.27 mm) pitch dual-row layout enables ultra-high-density board-stacking interconnects in a 0.525 × 0.225 inch footprint
- Square-pin-socket (SQ PIN-SKT) contact style with tin-on-nickel termination provides robust solder joint integrity for board stacking applications
What is TFM-108-02-F-D used for?
The TFM-108-02-F-D is designed for board-stacking applications in high-density embedded systems, memory modules, and FPGA mezzanine cards requiring reliable dual-row signal connectivity at 0.050" pitch. Its gold mating contacts and rectangular contact pattern make it ideal for high-cycle mating in test fixtures, development boards, and industrial control modules. The compact 0.525 × 0.225 inch body fits in tight PCB real estate where space savings of several millimeters are critical.
What are the specifications of TFM-108-02-F-D?
| YTEOL | 8.75 |
| Body Breadth | 0.225inch |
| Body Length | 0.525inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | AU ON NI |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Option 1 | GUIDE SLOT |
| Mounting Option 2 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 3.2A |
| Reference Standard | UL, CSA |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 16 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Where can I find the TFM-108-02-F-D datasheet?
TFM-108-02-F-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFM-108-02-F-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFM-108-02-F-D provide, and what is the row arrangement?
The TFM-108-02-F-D offers 16 total positions in a dual-row, rectangular contact pattern at 0.050" (1.27 mm) pitch, housed in a compact body measuring 0.525 inch long by 0.225 inch wide, suitable for high-density board stacking.
What contact finish does TFM-108-02-F-D use for mating, and why does it matter for signal reliability?
The mating contacts are finished with gold on nickel (Au on Ni), which provides contact resistance below 20 mΩ and corrosion resistance over thousands of mating cycles, making it far more reliable than tin-only finishes in high-frequency or high-cycle environments.
For a compact FPGA mezzanine card, is the TFM-108-02-F-D a suitable board-stacking connector?
Yes. The TFM-108-02-F-D is specifically rated as a board-stacking connector with a 0.050" pitch dual-row layout, gold-on-nickel mating surface, and a body footprint of 0.525 × 0.225 inch, making it well-matched for FMC or custom mezzanine stacking designs with 16 signal lines.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 42+ | $2.5300 | $106.26 |
| 500+ | $1.5700 | $785.00 |
| 1000+ | $1.4300 | $1430.00 |
| 2000+ | $1.1723 | $2344.58 |
| 5000+ | $1.0755 | $5377.25 |
| 10000+ | $0.9849 | $9849.00 |
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