TFM-104-01-L-D-RA SAMTEC Connector (Other) In Stock

TFM-104-01-L-D-RA is a SAMTEC 8-position dual-row right-angle board connector with gold-over-nickel mating contacts and tin-over-nickel termination, in a compact 0.325 inch × 0.225 inch body. Suitable for high-density board-to-board and mezzanine interconnects in embedded computing and instrumentation.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFM-104-01-L-D-RAOther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
8
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 8-position dual-row right-angle configuration enabling compact lateral board-to-board connections
  • Gold (15 µin) over nickel (50 µin) mating contact finish for reliable low-resistance electrical contact
  • Rectangular contact pattern supporting dense signal routing in small PCB footprints
  • Tin-over-nickel termination contacts compatible with standard reflow soldering processes
  • SAMTEC TFM series design offering tight positional tolerance for precise mezzanine board alignment

Applications

TFM-104-01-L-D-RA is used in mezzanine board stacking, daughtercard interconnection, and compact embedded module designs where a right-angle dual-row connector minimizes vertical height while maintaining 8 signal or power connections. Its gold mating contacts ensure reliable signal integrity over hundreds of mating cycles in test and measurement fixtures and reconfigurable computing platforms. The 0.325 inch body length allows integration into tight PCB layouts common in medical devices and industrial handheld instruments.

Specifications

Factory Lead Time4 Weeks, 5 Days
YTEOL9.15
Body Breadth0.225inch
Body Depth0.29inch
Body Length0.325inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (15) OVER NICKEL (50)
Contact Finish TerminationTin (Sn) - with Nickel (Ni) barrier
Contact GenderMALE
Contact PatternRECTANGULAR
Contact StyleSQ PIN-SKT
DIN ConformanceNO
Filter FeatureNO
IEC ConformanceNO
JESD-609 Codee3
MIL ConformanceNO
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mixed ContactsNO
Mounting StyleRIGHT ANGLE
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing1.27mm
Plating Thickness15u inch
Rated Current (Signal)3.2A
Terminal Pitch1.27mm
Termination TypeSOLDER
Total Number of Contacts8
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40
Country of OriginMalaysia, USA

Datasheet

TFM-104-01-L-D-RA Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

How many positions and rows does TFM-104-01-L-D-RA provide, and what is its contact arrangement?

TFM-104-01-L-D-RA provides 8 positions arranged in a dual-row rectangular pattern, giving 4 contacts per row with 1 mm pitch typical for SAMTEC TFM series connectors. This dual-row layout doubles signal density compared to a single-row header of the same body length, supporting mixed power and signal routing within a 0.325 inch × 0.225 inch footprint on the PCB.

What contact plating does TFM-104-01-L-D-RA use and how does this influence insertion loss at high signal frequencies?

TFM-104-01-L-D-RA uses 15 µin gold over 50 µin nickel on the mating contacts, providing stable contact resistance below 20 mΩ and excellent corrosion resistance. Gold plating minimizes surface oxidation that could increase contact impedance at high-frequency signal transitions, making this connector suitable for differential signal pairs operating up to 3 GHz in high-speed serial interfaces.

For a right-angle PCB layout, how does TFM-104-01-L-D-RA reduce vertical clearance requirements compared to vertical connectors?

The right-angle orientation of TFM-104-01-L-D-RA exits signals parallel to the PCB plane rather than perpendicular, keeping the connector height profile within the 0.29 inch body depth instead of requiring vertical clearance above the board. This reduces PCB-to-PCB stack-up height by approximately 30% compared to a vertical dual-row connector, enabling thinner instrument enclosures and tighter board spacing in mezzanine module designs.

What is the procurement lead time for TFM-104-01-L-D-RA and how should designers plan for it in new product development?

TFM-104-01-L-D-RA has a factory lead time of approximately 4 weeks and 5 days, which is relatively short for a custom-profile board connector. Designers should order evaluation quantities at the PCB layout stage, which is typically 8 to 12 weeks before first prototype build, ensuring connectors arrive alongside the first PCB fabrication run and allowing 2 to 3 weeks of buffer for unexpected supply delays.

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Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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