TFM-104-01-L-D-RA SAMTEC Connector (Other) In Stock
TFM-104-01-L-D-RA is a SAMTEC 8-position dual-row right-angle board connector with gold-over-nickel mating contacts and tin-over-nickel termination, in a compact 0.325 inch × 0.225 inch body. Suitable for high-density board-to-board and mezzanine interconnects in embedded computing and instrumentation.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 8
- Lifecycle
- ACTIVE
- Datasheet
- TFM-104-01-L-D-RA Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 8-position dual-row right-angle configuration enabling compact lateral board-to-board connections
- Gold (15 µin) over nickel (50 µin) mating contact finish for reliable low-resistance electrical contact
- Rectangular contact pattern supporting dense signal routing in small PCB footprints
- Tin-over-nickel termination contacts compatible with standard reflow soldering processes
- SAMTEC TFM series design offering tight positional tolerance for precise mezzanine board alignment
Applications
TFM-104-01-L-D-RA is used in mezzanine board stacking, daughtercard interconnection, and compact embedded module designs where a right-angle dual-row connector minimizes vertical height while maintaining 8 signal or power connections. Its gold mating contacts ensure reliable signal integrity over hundreds of mating cycles in test and measurement fixtures and reconfigurable computing platforms. The 0.325 inch body length allows integration into tight PCB layouts common in medical devices and industrial handheld instruments.
Specifications
| Factory Lead Time | 4 Weeks, 5 Days |
| YTEOL | 9.15 |
| Body Breadth | 0.225inch |
| Body Depth | 0.29inch |
| Body Length | 0.325inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (15) OVER NICKEL (50) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mixed Contacts | NO |
| Mounting Style | RIGHT ANGLE |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 1.27mm |
| Plating Thickness | 15u inch |
| Rated Current (Signal) | 3.2A |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 8 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and rows does TFM-104-01-L-D-RA provide, and what is its contact arrangement?
TFM-104-01-L-D-RA provides 8 positions arranged in a dual-row rectangular pattern, giving 4 contacts per row with 1 mm pitch typical for SAMTEC TFM series connectors. This dual-row layout doubles signal density compared to a single-row header of the same body length, supporting mixed power and signal routing within a 0.325 inch × 0.225 inch footprint on the PCB.
What contact plating does TFM-104-01-L-D-RA use and how does this influence insertion loss at high signal frequencies?
TFM-104-01-L-D-RA uses 15 µin gold over 50 µin nickel on the mating contacts, providing stable contact resistance below 20 mΩ and excellent corrosion resistance. Gold plating minimizes surface oxidation that could increase contact impedance at high-frequency signal transitions, making this connector suitable for differential signal pairs operating up to 3 GHz in high-speed serial interfaces.
For a right-angle PCB layout, how does TFM-104-01-L-D-RA reduce vertical clearance requirements compared to vertical connectors?
The right-angle orientation of TFM-104-01-L-D-RA exits signals parallel to the PCB plane rather than perpendicular, keeping the connector height profile within the 0.29 inch body depth instead of requiring vertical clearance above the board. This reduces PCB-to-PCB stack-up height by approximately 30% compared to a vertical dual-row connector, enabling thinner instrument enclosures and tighter board spacing in mezzanine module designs.
What is the procurement lead time for TFM-104-01-L-D-RA and how should designers plan for it in new product development?
TFM-104-01-L-D-RA has a factory lead time of approximately 4 weeks and 5 days, which is relatively short for a custom-profile board connector. Designers should order evaluation quantities at the PCB layout stage, which is typically 8 to 12 weeks before first prototype build, ensuring connectors arrive alongside the first PCB fabrication run and allowing 2 to 3 weeks of buffer for unexpected supply delays.
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