TFC-150-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-150-02-LM-D-A-K is a 100-position Tiger Eye dual-row board stacking connector with 0.050" (1.27 mm) pitch and tin-plated contacts over a nickel barrier. Measures 2.625 inch body length for reliable high-density stacking interconnects. Available worldwide with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TFC-150-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 100-position dual-row board stacking configuration at 0.050" pitch in a 2.625 inch body for maximum signal density
- Tin (Sn) over nickel (Ni) barrier contact finish providing reliable termination with good solderability in reflow assembly
- PEG board mounting option simplifying PCB alignment and reducing mechanical stress during assembly and operation
Applications
The TFC-150-02-LM-D-A-K is designed for board stacking applications in FPGA systems, industrial controllers, and high-channel signal processing boards where 100 signals must be routed between stacked PCBs. Its 2.625 inch body length accommodates the full 100-position dual-row layout at 0.050" pitch for efficient PCB area usage. The tin-over-nickel contact finish ensures compatible soldering with standard SMT reflow assembly processes.
Specifications
| YTEOL | 8.75 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 2.625inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 15u inch |
| Rated Current (Signal) | 3.1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 100 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the key physical dimensions and pin count of the TFC-150-02-LM-D-A-K?
The TFC-150-02-LM-D-A-K has a body length of 2.625 inches, body breadth of 0.225 inch, and body depth of 0.226 inch, providing 100 contact positions in a dual-row layout at 0.050" (1.27 mm) pitch. This compact form factor delivers high signal density suitable for board stacking interconnects in space-constrained systems.
Which contact finish does TFC-150-02-LM-D-A-K use at its termination, and how does this affect soldering?
The TFC-150-02-LM-D-A-K uses tin (Sn) over a nickel (Ni) barrier at the contact termination. The nickel barrier prevents tin diffusion and improves long-term solder joint reliability, while the tin finish provides excellent wettability during standard reflow soldering at temperatures up to 260°C, compatible with lead-free SMT assembly processes.
How does TFC-150-02-LM-D-A-K compare to a 96-position variant for designs requiring exactly 100 signal connections?
When a design requires exactly 100 signal lines between stacked PCBs, TFC-150-02-LM-D-A-K eliminates the need for a second supplemental connector that would be required with a 96-position part. Its 100-position dual-row layout at 0.050" pitch in a 2.625 inch body covers the full signal requirement in a single footprint, simplifying PCB routing and reducing connector count in the BOM.
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