TFC-150-02-F-D-A-K SAMTEC Connector (Other) In Stock
The SAMTEC TFC-150-02-F-D-A-K is a 100-position dual-row Tiger Eye terminal strip with 0.050 inch pitch, 3 microinch gold-plated male contacts, PEG board mount, and keying. It is a high-density cost-effective connector for FPGA and high-channel-count module board interfaces.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 100
- Lifecycle
- ACTIVE
- Datasheet
- TFC-150-02-F-D-A-K Datasheet PDF
- Category
- Connector
- Temp Range
- -55.0°C to 125.0°C
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 100-position dual-row configuration at 0.050 inch (1.27 mm) pitch with 50 contacts per row provides maximum signal density in a 2.625 inch body for FPGA and parallel bus module interfaces
- 3 microinch gold plating over phosphor bronze mating contacts with nickel barrier layer on tin-plated solder terminations ensures corrosion resistance and reliable solderability in PCB assembly
- PEG board mounting option mechanically anchors the 100-position 2.625 inch connector body to the PCB before soldering, preventing movement and ensuring through-hole contact alignment during wave soldering
Applications
The SAMTEC TFC-150-02-F-D-A-K is designed for very high-pin-count FPGA mezzanine card interfaces, parallel data bus backplanes, and high-channel data acquisition boards requiring 100 signal connections at 0.050 inch pitch in a single connector. Its gold-contact reliability and PEG retention make it ideal for test and measurement systems, telecom signal processing cards, and industrial multi-axis motion control modules where connector integrity across all 100 pins is critical.
Specifications
| YTEOL | 9.4 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 2.625inch |
| Connector Type | BOARD CONNECTOR |
| Contact Finish Mating | GOLD (3) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| Contact Pattern | RECTANGULAR |
| Contact Resistance | 15mΩ |
| Contact Style | SQ PIN-SKT |
| Dielectric Withstanding Voltage | 825VAC V |
| Filter Feature | NO |
| Insulation Resistance | 5000000000Ω |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 3u inch |
| Polarization Key | POLARIZED HOUSING |
| Rated Current (Signal) | 2.9A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 100 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What gold plating thickness does TFC-150-02-F-D-A-K use on its 100 mating contacts and how does that affect connector life?
The TFC-150-02-F-D-A-K uses 3 microinch gold plating on its 100 phosphor bronze mating contacts over a nickel barrier, which is appropriate for moderate mating cycle counts typical of module-to-backplane 0.050 inch pitch connectors, providing consistent low-resistance contact across all 100 positions while remaining more cost-effective than the 15 microinch gold used in high-cycle-count alternatives.
Why is the PEG mounting feature important for assembling the TFC-150-02-F-D-A-K on a PCB?
The PEG mounting feature locks the TFC-150-02-F-D-A-K's 2.625 inch, 100-position body in place on the PCB before wave or hand soldering, preventing any rotation or lateral movement that would misalign the dual-row 0.050 inch pitch through-hole contacts and cause solder bridging or open joints across the 100-pin footprint during high-temperature assembly.
For an FPGA board needing more than 96 I/O lines through one connector, how does TFC-150-02-F-D-A-K compare to using two TFC-126 connectors?
Using one TFC-150-02-F-D-A-K (100 positions at 0.050 inch pitch) versus two TFC-126-02 connectors (52 positions each, 104 total) reduces the connector footprint on the PCB from 2 connectors requiring separate keying and PEG mechanical features to a single 2.625 inch dual-row connector, simplifying PCB layout routing and bill of materials while delivering 100 pins in a keyed, PEG-retained package that eliminates mis-orientation risk.
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