TFC-147-02-L-D-A SAMTEC Connector (Other) In Stock
SAMTEC TFC-147-02-L-D-A is a 94-position dual-row Tiger Eye cost-effective terminal strip with 0.050-inch pitch, offering one of the highest position counts in the TFC series for very-high-density SMT board-to-board mezzanine interconnect. Gold-plated Tiger Eye contacts provide reliable low-resistance connections in communications and computing backplane applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 94
- Lifecycle
- ACTIVE
- Datasheet
- TFC-147-02-L-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-147-02-L-D-A?
- 94-position dual-row Tiger Eye terminal strip at 0.050" (1.27 mm) pitch for very-high-density board-to-board mezzanine stacking
- Tiger Eye dual-beam contact delivers wiping action that maintains contact resistance below 20 mΩ across 500+ mating cycles
- Cost-effective design supports high signal count interconnect at reduced BOM cost compared to premium Samtec connector series
- Surface mount termination compatible with standard lead-free reflow soldering profiles up to 260 °C
What is TFC-147-02-L-D-A used for?
The TFC-147-02-L-D-A is suited for very-high-density board-to-board mezzanine stacking in communications line cards, high-performance computing modules, and large FPGA carrier boards requiring 94 dual-row signal positions at 0.050-inch pitch. Its extended body length accommodates 47 signal pairs per row while maintaining the compact 0.050-inch pitch footprint. The Tiger Eye contact geometry ensures reliable electrical performance across the system's lifetime in both commercial and light industrial operating environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-147-02-L-D-A datasheet?
TFC-147-02-L-D-A Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-147-02-L-D-A?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal connections does the TFC-147-02-L-D-A provide, and how does this compare to smaller TFC variants?
The TFC-147-02-L-D-A provides 94 positions in a dual-row layout at 0.050-inch pitch, offering 47 contacts per row. This is among the largest position counts in the standard TFC series and provides 44 additional connections compared to a 50-position variant, all within the same 0.050-inch pitch footprint and compatible mating system. For applications needing more than 80 signal lines, the TFC-147 eliminates the need for multiple smaller connectors.
In which system architectures is the TFC-147-02-L-D-A most commonly used for mezzanine interconnect?
The TFC-147-02-L-D-A is commonly deployed in high-bandwidth communications line cards, FPGA daughter-board interfaces carrying parallel bus and I/O signals, and large embedded computing modules where 94 or more board-to-board connections must be made in a single connector footprint at 0.050-inch pitch. Its Tiger Eye contact design supports signal frequencies well above 100 MHz, suitable for high-speed parallel interfaces in these demanding architectures.
What contact reliability can be expected from the Tiger Eye contacts in the TFC-147-02-L-D-A over its service life?
The Tiger Eye contacts use a dual-beam spring design that provides 2 independent contact points and a wiping action during mating. This maintains contact resistance below 20 mΩ across a typical service life exceeding 500 mating cycles. Gold plating on the mating surface resists oxidation, ensuring consistent performance even in environments with moderate humidity and temperature cycling between -55 °C and +125 °C.
Can the TFC-147-02-L-D-A be assembled using standard SMT processes, and what reflow temperature does it support?
Yes. The TFC-147-02-L-D-A uses surface mount termination with a tin finish compatible with standard lead-free reflow soldering profiles peaking at 260 °C. Its 94-position dual-row footprint can be placed by automated pick-and-place systems. The connector's 0.050-inch pitch and rectangular contact pattern align with established SMT design rules, supporting reliable solder joints across all 94 positions in high-volume production.
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