TFC-144-02-LM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-144-02-LM-D-A-K-TR is an 88-position Tiger Eye cost-effective dual-row terminal strip with 0.050-inch (1.27 mm) pitch in tape-and-reel SMT packaging. It delivers reliable high-density board-to-board signal interconnection with low mating force contact design. Available from stock worldwide with fast shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 88
- Lifecycle
- ACTIVE
- Datasheet
- TFC-144-02-LM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 88-position dual-row terminal strip at 0.050-inch (1.27 mm) pitch for ultra-high-density board-to-board interconnection in compact PCB assemblies
- Tiger Eye contact technology provides low insertion force and self-wiping action for reliable multi-cycle mating performance across all 88 positions
- Tape-and-reel (TR) packaging supports automated SMT pick-and-place assembly for high-volume production with standard component feeders
- Cost-effective design offers a budget-friendly terminal strip solution for high-pin-count interconnection without sacrificing contact reliability
Applications
The TFC-144-02-LM-D-A-K-TR is well-suited for high-density board-to-board and module interconnection in telecommunications equipment, embedded computing platforms, and industrial automation systems requiring 88 simultaneous signal connections. Its 0.050-inch pitch compact form factor enables dense PCB routing on daughter cards, FPGA mezzanine modules, and backplane interface assemblies. The tape-and-reel format ensures compatibility with automated SMT assembly processes used in volume production environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFC-144-02-LM-D-A-K-TR provide and at what pitch?
The TFC-144-02-LM-D-A-K-TR provides 88 positions in a dual-row layout at 0.050-inch (1.27 mm) pitch. This high-density configuration allows 88 signals to be routed between PCBs in a small physical footprint, making it ideal for applications such as FPGA mezzanine cards, compute module sockets, and high-speed backplane connectors where space and signal count are both critical.
What advantage does the Tiger Eye contact design offer in the TFC-144-02-LM-D-A-K-TR?
The Tiger Eye contact design in the TFC-144-02-LM-D-A-K-TR uses a dual-beam wiping contact that clears oxide and contaminants from the mating pin surface during insertion, ensuring consistent low contact resistance across all 88 positions. This design supports reliable multiple insertion cycles, making the connector suitable for field-replaceable module applications and test socket use where repeated mating and unmating is expected over the connector's service life.
How does tape-and-reel packaging of the TFC-144-02-LM-D-A-K-TR support high-volume manufacturing?
The TR (tape-and-reel) packaging of the TFC-144-02-LM-D-A-K-TR feeds directly into standard SMT pick-and-place machines, allowing the 88-position connector to be placed at production rates consistent with other surface-mount components. This eliminates manual handling during board assembly, reduces placement errors, and supports reel sizes compatible with common feeder systems, lowering overall assembly cost per unit for production runs of hundreds to thousands of boards.
In which types of PCB designs is the TFC-144-02-LM-D-A-K-TR most commonly chosen over wider-pitch connectors?
The TFC-144-02-LM-D-A-K-TR is preferred over 0.100-inch pitch connectors when board space is constrained and a high signal count of 88 positions must be accommodated in roughly half the linear length. Applications such as FMC (FPGA Mezzanine Card) daughter board interfaces, DDR memory module edge connectors, and high-channel-count data acquisition boards frequently use 0.050-inch pitch terminal strips to maintain signal density while minimizing connector height and PCB real estate usage.
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