TFC-142-02-FM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-142-02-FM-D-A-K is an 84-position Tiger Eye dual-row terminal strip at 0.050-inch pitch, engineered for high-density board-to-cable or board-to-board signal routing in compact electronics. Cost-effective female socket design accommodates standard male headers in space-constrained PCB layouts. Available worldwide from authorized distributors with competitive pricing.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 84
- Lifecycle
- ACTIVE
- Datasheet
- TFC-142-02-FM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-142-02-FM-D-A-K?
- 84-position dual-row layout at 0.050 inch (1.27 mm) pitch, providing twice the circuit density of 0.100 inch pitch connectors in the same board real estate
- Tiger Eye contact technology delivering consistent 50 mΩ or lower contact resistance with a wiping action that clears oxide from mating pins for long-term signal reliability
- Cost-effective female socket design compatible with standard 0.050 inch pitch male headers across multiple PCB generations, reducing BOM cost versus precision machined alternatives
What is TFC-142-02-FM-D-A-K used for?
The TFC-142-02-FM-D-A-K is tailored for high-density daughter-card interfaces, FPGA expansion modules, and backplane interconnects in telecommunications and data-acquisition systems where 84 circuits must be routed in a minimal PCB footprint. Its 0.050 inch pitch female socket design is also widely used in embedded computing platforms and high-channel-count test fixtures where space constraints prevent the use of wider-pitch alternatives.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-142-02-FM-D-A-K datasheet?
TFC-142-02-FM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-142-02-FM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050-inch pitch of TFC-142-02-FM-D-A-K compare to standard 0.100-inch pitch connectors in terms of board space savings?
At 0.050 inch (1.27 mm) pitch, the TFC-142-02-FM-D-A-K occupies half the board length of an equivalent 0.100 inch pitch connector for the same 84-circuit count, reducing linear PCB footprint by approximately 50%. This density advantage translates to a row length of roughly 2.1 inches versus 4.2 inches at standard pitch, critical for compact embedded controllers and SBC expansion slots.
What does the Tiger Eye contact technology in TFC-142-02-FM-D-A-K provide that standard stamped-and-formed contacts do not?
Tiger Eye contacts feature a dual-beam wiping design that achieves contact resistance of 50 mΩ or lower while self-cleaning oxide layers from mating pins during insertion. This wiping action ensures stable signal transmission on 84 circuits even in lightly oxidized or contaminated pin fields, outperforming single-beam stamped contacts in environments with exposure to humidity or thermal cycling above 85°C.
For an FPGA development board needing 84 I/O connections to an expansion module, why is TFC-142-02-FM-D-A-K a cost-effective choice?
TFC-142-02-FM-D-A-K offers 84 female socket positions at 0.050 inch pitch in a single connector, eliminating the need for multiple smaller connectors and reducing assembly labor. Its cost-effective pricing relative to precision machined socket alternatives allows FPGA prototype and production designs to allocate budget to active components while still meeting 84-pin I/O requirements at a 1.27 mm pitch grid.
What mating connector types are compatible with TFC-142-02-FM-D-A-K, and are there stackable configurations available within the TFC series?
TFC-142-02-FM-D-A-K mates with SAMTEC TSM and TFM series male headers at 0.050 inch (1.27 mm) pitch in dual-row configurations of 84 positions. Within the SAMTEC TFC family, stacking height variants allow board-to-board separations from 8 mm to 30 mm, giving system designers flexibility to accommodate daughter cards of varying thicknesses in multi-board stack assemblies.
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