TFC-141-02-F-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-141-02-F-D-A-K-TR is an 82-position Tiger Eye cost-effective dual-row terminal strip on a compact 0.050" (1.27 mm) pitch for high-density board-to-board or cable-mate connections. Supplied in tape-and-reel packaging for automated PCB assembly, it suits applications requiring a large pin count in a minimal footprint. Available globally for high-volume production builds.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 82
- Lifecycle
- ACTIVE
- Datasheet
- TFC-141-02-F-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 82-position dual-row 0.050" (1.27 mm) pitch Tiger Eye design maximizes signal density in space-constrained interconnect applications
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume production efficiency
- Cost-effective Tiger Eye contact design reduces per-position connector cost without sacrificing reliable electrical contact performance
Applications
TFC-141-02-F-D-A-K-TR is used in high-density board-to-cable and board-to-board interconnect applications such as FPGA mezzanine cards, backplane expansion interfaces, and high-channel-count data acquisition systems where a large number of signals must be routed through a narrow 0.050" pitch connector. Its 82-position dual-row format and tape-and-reel delivery are ideal for automated assembly in telecommunications, test equipment, and compact embedded computing platforms.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050" pitch of TFC-141-02-F-D-A-K-TR compare to standard 0.100" pitch connectors for high-density designs?
TFC-141-02-F-D-A-K-TR uses a 0.050" (1.27 mm) pitch, which is half the spacing of standard 0.100" connectors, allowing 82 positions to fit in roughly the same PCB length as a 41-position 0.100" header. This 2x reduction in pin pitch is critical for FPGA mezzanine cards, test equipment, and high-channel-count signal boards where PCB edge connector space is limited.
What manufacturing advantage does the tape-and-reel packaging of TFC-141-02-F-D-A-K-TR provide for high-volume builds?
Tape-and-reel packaging allows TFC-141-02-F-D-A-K-TR to be loaded directly onto automated SMT pick-and-place equipment, eliminating manual connector placement across high-volume production runs. This reduces placement cycle time per board and minimizes human error on 82-position dual-row connectors where manual insertion on 0.050" pitch would be prone to misalignment across all 82 contacts.
For a data acquisition front-end requiring more than 64 channels, how does TFC-141-02-F-D-A-K-TR serve as an alternative to using multiple smaller connectors?
TFC-141-02-F-D-A-K-TR accommodates all 82 positions in a single connector on a 0.050" pitch, consolidating what would otherwise require two or more 40-position standard connectors on a 0.100" pitch. Using a single high-density connector reduces PCB real estate by eliminating multiple mating zones, simplifies cable routing to a single harness termination point, and decreases the risk of channel-to-connector cross-wiring errors during system integration.
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