TFC-139-02-FM-D-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-139-02-FM-D-K-TR is a 78-position Tiger Eye dual-row cost-effective terminal strip at 0.050" (1.27 mm) pitch with gold-plated FM contacts, friction-mate locking, and tape-and-reel SMD packaging. Rated at 1 A per contact and 125 V working voltage for dense board-to-board signal interconnection. Suitable for FPGA mezzanine, backplane, and test equipment designs with worldwide availability.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 78
- Lifecycle
- ACTIVE
- Datasheet
- TFC-139-02-FM-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-139-02-FM-D-K-TR?
- 78 positions in a dual-row layout at 0.050 inch (1.27 mm) pitch, delivering the highest signal density per millimeter of board edge among standard-pitch SMD terminal strips
- Gold-plated (FM) Tiger Eye contacts provide low contact resistance under 20 milliohms and withstand over 500 mate-demate cycles for high-reliability card-edge and mezzanine interfaces
- Friction-mate locking (K suffix) retains the mated connector under vibration and shock without requiring additional hardware latches, critical in rack-mount and mobile equipment
- Tape-and-reel (TR) packaging on EIA-481 compliant carrier tape supports automated SMD pick-and-place assembly at production volumes with minimal feeder interruptions
What is TFC-139-02-FM-D-K-TR used for?
The TFC-139-02-FM-D-K-TR is used on FPGA evaluation boards, high-speed data acquisition cards, and FMC mezzanine modules where 78 signals must cross a board-to-board boundary within a 50 mm connector span. Its 0.050 inch pitch allows dense signal routing on 4-layer PCBs that cannot accommodate wider 0.100 inch pitch headers. The gold-plated friction-mate contact system also suits automated test equipment fixtures requiring reliable signal paths over thousands of probe cycles.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-139-02-FM-D-K-TR datasheet?
TFC-139-02-FM-D-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-139-02-FM-D-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFC-139-02-FM-D-K-TR have and what is the mated height above the PCB surface?
The TFC-139-02-FM-D-K-TR has 78 positions arranged in 2 rows of 39 contacts at a 0.050 inch (1.27 mm) pitch. The mated stack height above the PCB surface is approximately 4 mm when mated with a compatible TFC series receptacle, making it one of the lowest-profile 78-position interconnect solutions available for board-to-board applications where enclosure height is constrained to less than 10 mm.
When would a designer choose the TFC-139-02-FM-D-K-TR over a standard 0.100 inch pitch dual-row connector with fewer positions?
When the PCB board edge is constrained to 50 mm or less and 78 or more signal lines must cross the interface, the 0.050 inch pitch TFC series is the correct choice. A 0.100 inch pitch dual-row connector with 78 positions would require approximately 100 mm of board edge, more than double the 50 mm needed by the TFC-139-02-FM-D-K-TR. This makes the TFC series essential for FMC (FPGA Mezzanine Card) and compact PCIe mezzanine designs operating on 3.3 V or 2.5 V LVDS signal rails.
What is the per-contact current rating of the TFC-139-02-FM-D-K-TR, and how many contacts should be paralleled for a 3.3 V power supply line?
Each contact is rated at 1 A continuous current. For a 3.3 V power rail delivering 3 A to a mezzanine module, designers should parallel at least 4 contacts with 25% headroom, allocating 4 adjacent pins as VCC and dedicating at least 4 more pins as ground returns to maintain a balanced impedance environment. The 78-position body provides ample contacts to accommodate 8 power/ground pins alongside 70 signal lines.
Does the friction-mate K locking feature on the TFC-139-02-FM-D-K-TR eliminate the need for board standoffs or screw retention in a mezzanine assembly?
The friction-mate locking mechanism provides retention force of approximately 0.1 N per contact, yielding roughly 8 N total mated retention for 78 positions. This is sufficient to resist PCB-level vibration in IEC 60068-2-6 Category 1 (5 Hz to 55 Hz, 0.35 mm displacement) but does not replace mechanical standoffs for applications subject to MIL-STD-810 shock (30 g, 11 ms half-sine). In benign rack-mount environments, the K locking alone is adequate and eliminates 2 standoff screws per mezzanine card.
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