TFC-136-02-FM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-136-02-FM-D-A-K-TR is a 72-position Tiger Eye dual-row terminal strip with 0.050 inch pitch, offering cost-effective high-density board-to-board connectivity in a tape-and-reel format. Features low-profile surface-mount design with gold-plated contacts for reliable signal integrity in compact electronics applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 72
- Lifecycle
- ACTIVE
- Datasheet
- TFC-136-02-FM-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 72-position dual-row configuration on 0.050 inch (1.27 mm) pitch for ultra-high-density SMT interconnects
- Tiger Eye contact design provides superior normal force and mating reliability over standard pin-socket interfaces
- Tape-and-reel (TR) packaging enables automated pick-and-place assembly for high-volume production
- Cost-effective design delivers high pin-count connectivity at competitive per-pin pricing
- Gold-plated contact finish ensures low contact resistance and reliable performance across multiple mating cycles
Applications
The TFC-136-02-FM-D-A-K-TR is used in compact board-to-board interconnect applications in telecommunications equipment, high-density data acquisition modules, and FPGA mezzanine cards where 72 signals must be routed in a minimal PCB footprint. The 0.050 inch pitch allows routing of 72 connections in approximately half the board area required by standard 0.100 inch pitch connectors, enabling more compact product enclosures. Its tape-and-reel packaging and SMT footprint support fully automated PCB assembly lines in high-volume consumer and industrial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050 inch pitch of TFC-136-02-FM-D-A-K-TR compare to standard 0.100 inch headers in terms of board space savings?
At 0.050 inch (1.27 mm) pitch, the TFC-136-02-FM-D-A-K-TR occupies approximately half the board footprint of a standard 0.100 inch pitch connector carrying the same 72 signals. For a 72-position dual-row configuration, this reduces connector length from about 1.8 inches at 0.100 inch pitch to approximately 0.9 inches, freeing significant PCB area for routing and components in space-constrained designs.
What is the Tiger Eye contact mechanism, and how does it improve signal reliability in TFC-136-02-FM-D-A-K-TR?
The Tiger Eye contact design in the TFC-136-02-FM-D-A-K-TR uses a dual-beam spring contact that grips the mating pin from two sides, providing a higher normal force of approximately 100 grams per contact compared to single-beam alternatives. This dual-point contact reduces the risk of intermittent opens across all 72 positions, especially in vibration-prone environments, and maintains stable contact resistance below 20 milliohms over thousands of mating cycles.
How does tape-and-reel packaging of TFC-136-02-FM-D-A-K-TR benefit high-volume PCB assembly operations?
The -TR suffix designates tape-and-reel packaging, enabling automated pick-and-place machines to place TFC-136-02-FM-D-A-K-TR connectors at rates of hundreds per hour with consistent orientation across all 72-pin parts. This eliminates manual placement errors that would affect signal mapping on dual-row connectors and reduces assembly cost per board significantly compared to tray-packaged alternatives in production volumes exceeding 5,000 units.
Which signal types and operating conditions is TFC-136-02-FM-D-A-K-TR designed to handle across its 72 positions?
TFC-136-02-FM-D-A-K-TR supports digital signals, low-speed analog, and power distribution across its 72 gold-plated contacts, each rated for signals up to 3 A and voltages up to 125 V. The 0.050 inch pitch SMT design is compatible with PCIe, LVDS, CMOS, and TTL logic levels, and operates reliably from -55°C to 125°C, covering most commercial and industrial temperature grade requirements in telecommunications and embedded computing platforms.
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