TFC-135-02-LM-D-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-135-02-LM-D-K-TR is a 70-position dual-row Tiger Eye cost-effective terminal strip with 0.050 inch (1.27 mm) pitch supplied in tape-and-reel for automated SMT assembly. It features male contacts with low-profile LM-series termination and dual-row K-series keying for reliable high-density board-to-board signal interconnects. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 70
- Lifecycle
- ACTIVE
- Datasheet
- TFC-135-02-LM-D-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 70-position dual-row layout at 0.050 inch (1.27 mm) pitch provides high signal density for compact board-to-board and board-to-mezzanine interconnects
- Tape-and-reel (TR) packaging is compatible with standard automated pick-and-place machines, reducing placement cost in high-volume SMT production
- Tiger Eye bifurcated contact design delivers dual-point wiping for consistent low contact resistance across multiple mating cycles in demanding field-replaceable module applications
Applications
The TFC-135-02-LM-D-K-TR is used in high-density mezzanine card, FPGA module, and single-board computer interconnects that require routing 70 signals between stacked PCBs in a minimal footprint. Its 0.050 inch dual-row pitch suits embedded computing platforms, telecom line cards, and industrial I/O expansion modules where board real estate is constrained. The tape-and-reel packaging and keyed dual-row configuration make it particularly well suited for high-volume automated assembly in commercial electronics manufacturing.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the position count and pitch of TFC-135-02-LM-D-K-TR, and how does this compare to other SAMTEC TFC series variants?
The TFC-135-02-LM-D-K-TR provides 70 positions in a dual-row configuration at 0.050 inch (1.27 mm) pitch. Within the SAMTEC TFC series, this positions it between lower-count variants such as the TFC-124-02 (48 positions) and higher-count options such as the TFC-142-02 (84 positions), making it the right choice when 60 to 70 signal lines must be routed between boards with more than the 48-pin variant offers but without the full 84-pin footprint.
Why does the -K- keying designation in TFC-135-02-LM-D-K-TR matter for assembly and field service?
The K-series keying feature adds a polarization key to the connector body, physically preventing the mating connector from being inserted in the wrong orientation or into a non-keyed mating receptacle. This is critical on boards with multiple adjacent TFC connectors of the same position count, as a keying mismatch would immediately reject an incorrect mating attempt and prevent 70 signals from being cross-connected. In field service environments where technicians swap mezzanine cards under time pressure, keying reduces costly mismate damage to boards valued at hundreds of dollars.
What assembly advantages does the tape-and-reel (TR) packaging of TFC-135-02-LM-D-K-TR provide in SMT production?
Tape-and-reel (TR) packaging allows the TFC-135-02-LM-D-K-TR to be fed directly into a pick-and-place machine feeder reel, enabling placement rates comparable to passive components. For a production run of 1,000 boards each carrying 2 connectors, reel-fed placement eliminates approximately 2,000 manual placements, reducing placement labor cost by 80% to 90% compared to tray-fed connectors. The consistent orientation in the tape carrier also reduces placement error rates for this 70-position fine-pitch connector.
For an FPGA mezzanine module using 64 LVDS pairs, how well does TFC-135-02-LM-D-K-TR fit the signal routing requirement?
A 64 LVDS pair interface requires 128 signal pins plus additional ground and power pins, exceeding the 70 positions of a single TFC-135-02-LM-D-K-TR. A practical implementation would use 2 connectors providing 140 total positions, dedicating 128 positions to differential LVDS pairs and the remaining 12 to ground returns and auxiliary power. At 0.050 inch pitch in a dual-row layout, 2 connectors span approximately 44 mm of total board edge, a footprint compatible with standard FPGA mezzanine card form factors.
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