TFC-135-02-L-D-A-K-TR SAMTEC Connector (Other) In Stock

The TFC-135-02-L-D-A-K-TR is a SAMTEC Tiger Eye 70-position dual-row board connector terminal strip with 0.050 inch pitch and 15 µin gold mating contacts over phosphor bronze. Its compact 1.875 inch body with peg mounting suits high-density PCB interconnect in industrial and computing applications. Available worldwide in tape-and-reel for automated production assembly.

ACTIVEConnectorVerified Jun 2026
Package / Visual Reference
TFC-135-02-L-D-A-K-TROther
Quick Facts
Manufacturer
SAMTEC
Package
Other
Pin Count
70
Lifecycle
ACTIVE
Category
Connector
Temp Range
-55.0°C to 125.0°C
RoHS
Compliant
Lead Time
3–7 business days
Shipping
DHL Express · Worldwide

Key Features

  • 70-position dual-row terminal strip at 0.050 inch (1.27 mm) pitch enabling extremely high contact density in a 1.875 inch body length
  • 15 µin gold over phosphor bronze mating contacts providing excellent electrical conductivity and wear resistance across thousands of mating cycles
  • Peg board mounting option secures the connector mechanically during soldering and in-service vibration, improving solder joint integrity on 70-position assemblies
  • Matte tin termination finish on PCB tails compatible with lead-free reflow soldering processes at standard assembly temperatures up to 260°C
  • Tape-and-reel packaging (TR suffix) enabling automated pick-and-place for high-volume SMT PCB manufacturing with consistent placement accuracy

Applications

The TFC-135-02-L-D-A-K-TR is used in high-density PCB-to-PCB and cable-to-board interface designs within embedded computing modules, FPGA development boards, and industrial I/O expansion cards where 70 contacts at 0.050 inch pitch are required in a minimal footprint. Its phosphor bronze contacts with 15 µin gold finish make it suitable for applications with frequent mating cycles, such as test and measurement fixtures and hot-swappable module interfaces. The connector also serves backplane assemblies and communications equipment where compact dual-row terminal strips must carry both signal and low-voltage power across multiple board positions.

Specifications

YTEOL9.4
Board Mounting OptionPEG
Body Breadth0.225inch
Body Depth0.226inch
Body Length1.875inch
Connector TypeBOARD CONNECTOR
Contact Finish MatingGOLD (15)
Contact Finish TerminationMatte Tin (Sn)
Contact GenderMALE
Contact MaterialPHOSPHOR BRONZE
Contact PatternRECTANGULAR
Contact Resistance15
Contact StyleSQ PIN-SKT
Dielectric Withstanding Voltage825VAC V
Filter FeatureNO
Insulation Resistance5000000000Ω
Insulator ColorBLACK
Insulator MaterialLIQUID CRYSTAL POLYMER
JESD-609 Codee3
Mating Contact Pitch0.05inch
Mating Contact Row Spacing0.05inch
Mating InformationMULTIPLE MATING PARTS AVAILABLE
Mixed ContactsNO
Mounting StyleSTRAIGHT
Mounting TypeBOARD
Number Of ConnectorsONE
Number Of PCB Rows2
Number of Rows Loaded2
OptionGENERAL PURPOSE
PCB Contact PatternRECTANGULAR
PCB Contact Row Spacing3.43mm
Plating Thickness15u inch
Polarization KeyPOLARIZED HOUSING
Rated Current (Signal)2.9A
Reference StandardUL
Terminal Pitch1.27mm
Termination TypeSURFACE MOUNT
Total Number of Contacts70
UL Flammability Code94V-0
PackageOther

Compliance & Regulatory

RoHS StatusCompliant
Lead-FreeYes (Pb-Free)
ECCNEAR99
HTS Code8536.69.40.40

Datasheet

TFC-135-02-L-D-A-K-TR Datasheet Download

Official datasheet from SAMTEC

Alternate & Equivalent Parts

No known alternates. Submit an RFQ and our team can suggest alternatives.

Frequently Asked Questions

What contact pitch and total position count does the TFC-135-02-L-D-A-K-TR offer for high-density PCB designs?

The TFC-135-02-L-D-A-K-TR features a 0.050 inch (1.27 mm) pitch with 70 positions in a dual-row configuration, providing a very high contact density within a 1.875 inch body length. This pitch is half of the standard 0.100 inch spacing, making it suitable for compact designs such as FPGA breakout boards and high-channel-count I/O module connectors where space is at a premium.

What is the contact material and plating specification of the TFC-135-02-L-D-A-K-TR, and how does it affect connector longevity?

The TFC-135-02-L-D-A-K-TR uses phosphor bronze contacts with 15 µin gold mating finish over nickel underplate. Phosphor bronze provides excellent spring force retention over thousands of mating cycles, and 15 µin gold delivers low contact resistance and corrosion resistance needed for reliable signal integrity across 70 contact positions in computing and industrial applications.

How does the peg mounting feature benefit the TFC-135-02-L-D-A-K-TR during PCB assembly and vibration service?

The peg mounting option provides a mechanical post that inserts into a PCB hole, anchoring the 1.875 inch connector body and preventing lateral movement during reflow soldering and under mechanical vibration. For a 70-position connector with matte tin termination tails, this is essential for maintaining uniform solder joint quality across all contacts during high-temperature reflow and in vibration-prone applications like industrial machine control boards.

Which board-to-board or module stacking applications are best served by the TFC-135-02-L-D-A-K-TR connector?

The TFC-135-02-L-D-A-K-TR is best suited for FPGA mezzanine modules, high-density backplane interconnects, and test fixture interfaces where 70 signal lines at 0.050 inch pitch must be reliably connected in under 2 inches of board length. Its Tiger Eye contact design with 15 µin gold and phosphor bronze spring contacts also serves RF and digital test systems requiring low-resistance, repeatable connections for automated test equipment and debug probe interfaces.

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AvailabilityIn Stock
Reference Price (USD)
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In Stock · 24h Response · Worldwide Shipping

Lead Time3-7 business days
MOQFrom 1 piece
ShippingDHL / FedEx / UPS
OriginChina (Authorized)

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