TFC-133-02-L-D-A-K-TR SAMTEC Connector (Other) In Stock
TFC-133-02-L-D-A-K-TR is a Samtec Tiger Eye 66-position dual-row cost-effective terminal strip with 0.050 inch (1.27 mm) pitch, designed for high-density PCB signal interconnection. Ideal for board-to-board and wire-to-board applications in data acquisition and embedded systems.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 66
- Lifecycle
- ACTIVE
- Datasheet
- TFC-133-02-L-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-133-02-L-D-A-K-TR?
- 66 total contact positions in dual-row configuration for high-density signal routing
- 0.050 inch (1.27 mm) pitch for space-efficient PCB layout
- Tiger Eye contact design providing reliable low-insertion-force mating
- Tape-and-reel packaging (TR suffix) for automated SMT assembly compatibility
- Cost-effective terminal strip format suitable for high-volume production
What is TFC-133-02-L-D-A-K-TR used for?
The TFC-133-02-L-D-A-K-TR is designed for high-density signal interconnection on PCBs in embedded computing, data acquisition, and industrial control systems where compact 0.050 inch pitch connectors are required. Its 66-position dual-row layout supports parallel bus interfaces, FPGA I/O expansion, and backplane signal distribution in space-constrained enclosures. The tape-and-reel packaging makes this connector well-suited for automated pick-and-place assembly in high-volume manufacturing environments.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-133-02-L-D-A-K-TR datasheet?
TFC-133-02-L-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-133-02-L-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TFC-133-02-L-D-A-K-TR connector provide and what is its row configuration?
The TFC-133-02-L-D-A-K-TR provides 66 total contact positions arranged in a dual-row configuration with 33 contacts per row at 0.050 inch (1.27 mm) pitch. This layout supports high-density parallel signal routing typical of FPGA I/O headers and backplane interconnects.
What pitch does the TFC-133-02-L-D-A-K-TR use and how does that affect PCB layout density?
The TFC-133-02-L-D-A-K-TR uses a 0.050 inch (1.27 mm) contact pitch, which is half the legacy 0.100 inch standard. This finer pitch allows 66 contacts to occupy less than 42 mm of board length in a dual-row layout, significantly reducing the PCB footprint compared to standard density connectors.
Is the TFC-133-02-L-D-A-K-TR suitable for automated assembly and what packaging format does it ship in?
Yes, the TR suffix on the TFC-133-02-L-D-A-K-TR indicates tape-and-reel packaging, which is fully compatible with automated SMT pick-and-place equipment. This makes the connector well-suited for high-volume PCB assembly lines where manual placement of 66-position connectors would increase production cycle time.
In what types of industrial or embedded applications does the TFC-133-02-L-D-A-K-TR connector typically appear?
The TFC-133-02-L-D-A-K-TR is commonly used in FPGA development boards, data acquisition cards, and industrial I/O expansion modules requiring 66 signal connections within a 0.050 inch pitch footprint. It also appears in test and measurement equipment where compact board-to-board mating at 1.27 mm pitch conserves front-panel space.
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