TFC-132-02-F-D-A-K-TR SAMTEC Connector (Other) In Stock
The SAMTEC TFC-132-02-F-D-A-K-TR is a 64-position Tiger Eye board stacking connector on 0.050-inch pitch with dual-row male square pins, peg mounting, tin-over-nickel contact finish, and tape-and-reel packaging. Measuring 1.725 × 0.225 × 0.226 inches, it delivers a cost-effective, high-density 64-circuit board-to-board stacking interface for embedded computing and RF module designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 64
- Lifecycle
- ACTIVE
- Datasheet
- TFC-132-02-F-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 64-position dual-row Tiger Eye design on 0.050 inch (1.27 mm) pitch fits 64 signals into a 1.725 inch body, providing approximately twice the density of equivalent 0.100 inch pitch board stacking connectors
- Peg mounting option secures the connector to the PCB before soldering, preventing tilt or shifting during reflow and improving first-pass assembly yield on fine-pitch layouts
- Tin (Sn) over nickel (Ni) barrier contact finish on square pins delivers reliable solderability and corrosion resistance compatible with lead-free SAC305 reflow profiles peaking near 260°C
Applications
The TFC-132-02-F-D-A-K-TR is primarily used in board-to-board stacking assemblies within FPGA development platforms, single-board computers, and RF front-end modules where 64 high-speed signals must be routed between a host PCB and a plug-in daughter card with minimal connector height overhead. Its 0.050-inch pitch and compact 1.725-inch body make it a natural fit for small-form-factor embedded modules such as COM Express and SMARC carrier-to-module interfaces. The tape-and-reel format also makes this part ideal for high-volume SMT production lines building wireless IoT gateways or industrial sensor hubs that integrate stacked PCB sub-assemblies.
Specifications
| YTEOL | 8.75 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 1.725inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 3u inch |
| Rated Current (Signal) | 3.1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 64 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | Malaysia, USA |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How does the 0.050-inch pitch of the TFC-132-02-F-D-A-K-TR reduce PCB real estate compared to a standard 0.100-inch pitch 64-position connector?
At 0.050 inch (1.27 mm) pitch, the TFC-132-02-F-D-A-K-TR has a row length of 32 contacts × 1.27 mm ≈ 40.6 mm, compared to approximately 81.3 mm for a 0.100-inch pitch equivalent. This halves the connector footprint length, freeing over 40 mm of board edge for other components—a meaningful saving on dense PCBs where connector area directly competes with routing channels and decoupling capacitors.
What role does the peg mounting feature play in the TFC-132-02-F-D-A-K-TR assembly process?
The peg (also called a polarizing peg or retention peg) snaps into a corresponding hole in the PCB, locking the connector in its correct position and orientation before reflow. For a fine-pitch 64-pin connector at 0.050 inch pitch, even a 0.1 mm placement offset can bridge adjacent pads; the peg eliminates this risk by removing reliance on pick-and-place accuracy alone, improving first-pass solder yield in high-volume automated assembly.
What is the typical board stacking height range available for the TFC-132-02-F-D-A-K-TR, and how does that affect module enclosure design?
SAMTEC TFC-series board stacking connectors are offered in multiple mated stack heights, commonly ranging from approximately 4 mm to 20 mm between the two PCBs. Selecting the correct stack height determines the minimum internal clearance inside the module enclosure; a 4 mm stack may be too tight for taller SMT components on the daughter card, while an 8 mm or 10 mm variant provides sufficient clearance for standard 0402/0603 passives and most IC packages.
For which high-speed signal standards is the TFC-132-02-F-D-A-K-TR Tiger Eye contact suitable, and what data rate limitation should designers plan for?
SAMTEC's Tiger Eye contacts are designed and characterized for high-speed digital applications including USB 2.0 (480 Mbit/s), SDIO, and parallel interfaces up to several hundred MHz. For interfaces requiring multi-Gbit/s performance such as PCIe Gen 2 or USB 3.0 at 5 Gbit/s, designers should consult SAMTEC's S-parameter data for the specific TFC stack height, as impedance continuity and crosstalk across 64 contacts at 0.050 inch pitch can become the signal integrity bottleneck above approximately 1–2 GHz.
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