TFC-130-02-L-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-130-02-L-D-A-K-TR is a 60-position Tiger Eye dual-row board stacking connector with 0.050" pitch, tin-over-nickel contact finish, designed for reliable high-density PCB interconnections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 60
- Lifecycle
- ACTIVE
- Datasheet
- TFC-130-02-L-D-A-K-TR Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 60-position dual-row Tiger Eye design with 0.050" (1.27 mm) pitch for high-density board stacking
- Tin (Sn) over Nickel (Ni) contact finish for excellent corrosion resistance and reliable signal integrity
- PEG board mounting option with rectangular SQ pin-socket contacts for secure mechanical retention
- Cost-effective terminal strip format suitable for compact, space-constrained electronic assemblies
Applications
The TFC-130-02-L-D-A-K-TR is used in high-density board-to-board stacking applications such as embedded computing modules, industrial control cards, and communication backplanes. Its 0.050" pitch and 60-position dual-row layout make it ideal for space-constrained designs requiring reliable mezzanine interconnects. It is well suited for prototyping platforms, test fixtures, and compact consumer electronics requiring dense, low-profile connectors.
Specifications
| YTEOL | 8.75 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 1.625inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 15u inch |
| Rated Current (Signal) | 3.1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 60 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What is the pitch and pin count of the TFC-130-02-L-D-A-K-TR connector?
The TFC-130-02-L-D-A-K-TR is a 60-position dual-row connector with a 0.050" (1.27 mm) pitch. This tight pitch allows placement of 60 pins within a body length of approximately 1.625 inches, supporting high-density board stacking in compact PCB designs.
Which board mounting option does TFC-130-02-L-D-A-K-TR support and how does it secure to the PCB?
The TFC-130-02-L-D-A-K-TR uses a PEG board mounting option with rectangular SQ pin-socket contacts. The peg configuration mechanically locks the connector body to the PCB, providing robust retention even under vibration, making it suitable for industrial and embedded systems requiring 60 secure connections.
What contact finish does TFC-130-02-L-D-A-K-TR use and why does it matter for signal reliability?
The connector uses Tin (Sn) over a Nickel (Ni) barrier contact finish. The nickel underplate provides a diffusion barrier preventing copper migration, while the tin outer layer ensures low contact resistance. This finish maintains reliable conductivity across 60 pins in typical operating temperature ranges, reducing risk of intermittent connections over the product lifetime.
In which applications is the TFC-130-02-L-D-A-K-TR commonly used?
The TFC-130-02-L-D-A-K-TR is commonly used in embedded computing modules, industrial control backplanes, and test-and-measurement fixtures. Its 0.050" pitch dual-row configuration with 60 positions supports high signal-count mezzanine stacking where PCB real estate is limited to a body footprint of approximately 1.625 inches by 0.226 inches.
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