TFC-127-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-127-02-LM-D-A-K is a 54-position dual-row Tiger Eye cost-effective terminal strip connector with 0.050" (1.27 mm) pitch. Gold-plated mating contacts on phosphor bronze deliver reliable low-resistance interconnects for embedded computing, industrial, and mezzanine PCB designs.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 54
- Lifecycle
- ACTIVE
- Datasheet
- TFC-127-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-127-02-LM-D-A-K?
- 54-position dual-row configuration at 0.050" (1.27 mm) pitch for high-density mezzanine and board-to-board interconnects
- Gold-plated mating contacts on phosphor bronze ensure stable, low contact resistance across the rated mating cycle life
- Tiger Eye cost-effective design provides an economical 54-pin dual-row 1.27 mm pitch option for volume production
- Dual-row 54-pin layout consolidates large signal counts into a compact footprint for space-constrained PCB assemblies
What is TFC-127-02-LM-D-A-K used for?
The TFC-127-02-LM-D-A-K is ideal for high-pin-count mezzanine board stacking, backplane interconnect, and daughter-card interfaces in FPGA platforms, embedded servers, and large-scale industrial control systems. Its 54-position dual-row 0.050" pitch design lets designers route many parallel signals through a single compact connector, simplifying board routing and reducing connector count. The Tiger Eye series construction keeps the unit cost competitive for medium-to-high volume production runs.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Where can I find the TFC-127-02-LM-D-A-K datasheet?
TFC-127-02-LM-D-A-K Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-127-02-LM-D-A-K?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What signal capacity does the TFC-127-02-LM-D-A-K provide, and what is the connector pitch?
The TFC-127-02-LM-D-A-K offers 54 signal positions arranged in a dual-row (2-row) layout at 0.050" (1.27 mm) pitch. This high-density configuration is designed for mezzanine board stacking, daughter-card interfaces, and backplane connections in embedded computing and industrial systems requiring 54 parallel signal routes.
How does the TFC-127-02-LM-D-A-K reduce assembly complexity on FPGA daughter-card designs?
By providing all 54 positions in a single dual-row 1.27 mm pitch connector, TFC-127-02-LM-D-A-K eliminates the need for multiple smaller connectors to route the same signal count. This simplifies PCB layout, reduces the number of individual component placements during assembly, and minimizes the risk of misaligned mating that can occur when multiple separate connectors are stacked on FPGA daughter-card to baseboard interfaces.
What contact material and finish does TFC-127-02-LM-D-A-K use, and how does it affect signal integrity?
The TFC-127-02-LM-D-A-K features phosphor bronze contacts with gold plating on the mating surfaces. Gold plating maintains contact resistance typically below 20 milliohms over the rated mating cycles, resisting corrosion and oxidation. This ensures stable, low-loss signal transmission across all 54 positions, which is critical for maintaining signal integrity in high-speed digital or mixed-signal embedded systems.
For a procurement engineer sourcing 54-pin dual-row 1.27 mm pitch connectors in volume, when is TFC-127-02-LM-D-A-K the right choice?
TFC-127-02-LM-D-A-K is the right volume procurement choice when the application requires 54-pin dual-row connectivity at 0.050" (1.27 mm) pitch and the operating environment does not demand the highest mating cycle ratings or extreme environmental specifications required by premium SAMTEC series. The Tiger Eye cost-effective design lowers per-unit cost without sacrificing gold-plated contact reliability, making it the optimal cost-per-pin option for medium-to-high volume industrial and embedded computing production runs.
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