TFC-125-02-FM-D-A-K-TR SAMTEC Connector (Other) In Stock
SAMTEC TFC-125-02-FM-D-A-K-TR is a 50-position Tiger Eye board stacking connector with 0.050" pitch and tin/nickel contact finish. Features dual-row male rectangular contacts in a compact 1.375" body with PEG board mounting. Available from stock with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 50
- Lifecycle
- ACTIVE
- Datasheet
- TFC-125-02-FM-D-A-K-TR Datasheet PDF
- Category
- Connector
- Price
- From $2.2922(MOQ 100)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-125-02-FM-D-A-K-TR?
- 50-position dual-row Tiger Eye terminal strip with cost-effective tin/nickel contact finish
- Ultra-fine 0.050" (1.27 mm) pitch enables high-density board stacking in compact PCB layouts
- PEG board mounting option with 1.375" body length for secure mechanical retention during assembly
What is TFC-125-02-FM-D-A-K-TR used for?
The TFC-125-02-FM-D-A-K-TR is suited for high-density board-to-board stacking in embedded computing modules, industrial control backplanes, and compact data acquisition systems. Its 0.050" pitch and 50-position dual-row configuration allow engineers to route 50 signals across two boards within a minimal footprint. The tin/nickel contact finish ensures reliable connectivity in cost-sensitive applications such as telecom daughter cards and test fixture interconnects.
What are the specifications of TFC-125-02-FM-D-A-K-TR?
| YTEOL | 8.75 |
| Board Mounting Option | PEG |
| Body Breadth | 0.225inch |
| Body Depth | 0.226inch |
| Body Length | 1.375inch |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Pattern | RECTANGULAR |
| Contact Style | SQ PIN-SKT |
| Filter Feature | NO |
| Insulator Color | BLACK |
| Insulator Material | LIQUID CRYSTAL POLYMER |
| JESD-609 Code | e3 |
| Mating Contact Pitch | 0.05inch |
| Mating Contact Row Spacing | 0.05inch |
| Mating Information | MULTIPLE MATING PARTS AVAILABLE |
| Mixed Contacts | NO |
| Mounting Option 1 | LOCKING |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number Of PCB Rows | 2 |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| PCB Contact Pattern | RECTANGULAR |
| PCB Contact Row Spacing | 3.43mm |
| Plating Thickness | 3u inch |
| Rated Current (Signal) | 3.1A |
| Reference Standard | UL |
| Terminal Pitch | 1.27mm |
| Termination Type | SURFACE MOUNT |
| Total Number of Contacts | 50 |
| UL Flammability Code | 94V-0 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
| Country of Origin | France, Malaysia |
Where can I find the TFC-125-02-FM-D-A-K-TR datasheet?
TFC-125-02-FM-D-A-K-TR Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-125-02-FM-D-A-K-TR?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many signal positions does the TFC-125-02-FM-D-A-K-TR provide, and how are they arranged?
The TFC-125-02-FM-D-A-K-TR provides 50 positions arranged in a dual-row rectangular pattern at 0.050" (1.27 mm) pitch. This configuration allows 25 contacts per row, enabling high pin-count board stacking connections within a body length of only 1.375 inches.
Which board stacking scenarios benefit most from the TFC-125-02-FM-D-A-K-TR's 0.050" pitch and PEG mounting?
Designs requiring dense signal routing between a processor board and a peripheral module—such as FPGA mezzanine cards or SOM carrier boards—benefit most. The 0.050" (1.27 mm) pitch packs 50 contacts into a 1.375" footprint, while PEG mounting locks the connector during reflow to maintain co-planarity across dual-row contacts.
What contact finish is used on the TFC-125-02-FM-D-A-K-TR and how does it affect solderability?
The TFC-125-02-FM-D-A-K-TR uses tin (Sn) plating over a nickel (Ni) barrier on the contact terminations. Tin plating is compatible with standard lead-free reflow soldering at temperatures up to 260°C, and the nickel barrier prevents copper migration, maintaining contact integrity over at least 30 mating cycles.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 100+ | $3.7900 | $379.00 |
| 500+ | $3.2600 | $1630.00 |
| 1000+ | $2.9300 | $2930.00 |
| 1125+ | $2.6434 | $2973.79 |
| 2500+ | $2.4860 | $6215.00 |
| 2625+ | $2.2922 | $6017.08 |
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