TFC-124-02-LM-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-124-02-LM-D-A-K is a 48-position dual-row Tiger Eye cost-effective terminal strip with 0.050" pitch and low-profile LM style, ideal for high-density board stacking interconnections.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- TFC-124-02-LM-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 48-position dual-row configuration with 0.050" (1.27 mm) pitch for high-density mezzanine board stacking
- Low-profile LM contact style enabling space-constrained PCB designs with minimal stacking height
- Tiger Eye cost-effective terminal strip design offering reliable electrical performance at competitive pricing
- Dual-row rectangular contact pattern supporting up to 48 signals in a compact footprint
Applications
The TFC-124-02-LM-D-A-K is designed for board-to-board stacking applications including embedded computing modules, industrial I/O cards, and communication daughterboards. Its 48-position dual-row layout with 0.050" pitch provides a high signal density in compact form factors. This connector is well suited for low-profile mezzanine assemblies in consumer electronics, test fixtures, and modular embedded systems.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions does the TFC-124-02-LM-D-A-K provide and what is its contact pitch?
The TFC-124-02-LM-D-A-K offers 48 positions arranged in a dual-row configuration with a 0.050" (1.27 mm) pitch. This compact pitch allows designers to route 48 signals across 2 rows in a footprint suitable for space-constrained mezzanine and board stacking PCB designs.
What makes the LM contact style of TFC-124-02-LM-D-A-K suitable for low-profile assemblies?
The LM contact style used in the TFC-124-02-LM-D-A-K features a low-profile height that reduces overall stacking height between mated PCBs. Combined with the 0.050" pitch and 48 dual-row positions, it enables slim mezzanine assemblies where vertical board clearance is a critical constraint in embedded and compact system designs.
In which application areas is TFC-124-02-LM-D-A-K most commonly deployed?
The TFC-124-02-LM-D-A-K is commonly used in embedded computing modules, industrial control systems, and test-and-measurement equipment. Its 48-position dual-row layout at 0.050" pitch supports high signal count mezzanine stacking, making it a reliable choice for daughterboard interconnects requiring low-profile 48-pin connections.
When would a designer choose TFC-124-02-LM-D-A-K over a wider pitch connector for a high-density PCB?
When PCB real estate is limited and a design requires 48 or more signals on a mezzanine interface, the TFC-124-02-LM-D-A-K's 0.050" pitch provides significantly higher density than standard 0.100" pitch alternatives. It fits in a footprint approximately half the length required by 2.54 mm pitch connectors while maintaining reliable contact engagement across all 48 pins.
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