TFC-124-02-L-D-A-K SAMTEC Connector (Other) In Stock
SAMTEC TFC-124-02-L-D-A-K is a 48-position Tiger Eye cost-effective terminal strip with 0.050" (1.27 mm) pitch, dual-row surface-mount design offering reliable signal connectivity for high-density board interconnect applications with gold-plated contacts.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 48
- Lifecycle
- ACTIVE
- Datasheet
- TFC-124-02-L-D-A-K Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 48-position dual-row configuration at 0.050" (1.27 mm) pitch provides compact high-density signal routing on constrained PCBs
- Tiger Eye precision machined contacts ensure consistent normal force and low contact resistance over repeated mating cycles
- Gold-plated mating interface delivers corrosion resistance and stable electrical performance in demanding environments
- Cost-effective terminal strip construction maintains Samtec's quality standards while reducing component cost per pin for volume designs
Applications
The TFC-124-02-L-D-A-K is suited for mid-density daughter card and mezzanine interconnect designs where 48 signal lines must be exchanged between stacked boards within a 1.27 mm pitch SMT footprint. Common applications include embedded processor modules, compact test-and-measurement instruments, and industrial I/O expansion boards. Its low-profile dual-row layout conserves board space in enclosures with height restrictions below 10 mm stack height.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What are the key electrical and mechanical specifications of the TFC-124-02-L-D-A-K?
The TFC-124-02-L-D-A-K offers 48 positions in a dual-row SMT layout at 0.050" (1.27 mm) pitch. Contacts are gold-plated to a minimum of 30 µin on the mating surface, supporting low contact resistance typically below 20 mΩ. The housing is rated for standard reflow temperatures up to 260°C, and the connector is designed for 100 or more mating cycles in its intended application.
How does TFC-124-02-L-D-A-K compare to a higher-count variant such as TFC-142-02-LM-D-A-K for board interconnect selection?
The TFC-124-02-L-D-A-K provides 48 positions at 1.27 mm pitch, making it roughly 43% smaller in contact count than the 84-position TFC-142-02-LM-D-A-K. For designs needing fewer than 50 signal lines, the 48-position variant reduces PCB footprint length by approximately 25 mm, lowers cost per assembly, and simplifies routing on 4-layer boards without requiring the longer 84-contact solder pad area.
Which embedded system and industrial control designs benefit most from the TFC-124-02-L-D-A-K?
Embedded computing modules using ARM or FPGA processors with up to 48 GPIO or differential signals benefit directly from the TFC-124-02-L-D-A-K. Industrial PLC expansion cards, compact motor-drive interface boards, and sub-rack controller modules operating from 3.3 V to 5 V logic rails use this connector to achieve a dense 1.27 mm pitch footprint in enclosures with PCB-to-PCB stack heights as low as 5 mm.
Can the TFC-124-02-L-D-A-K be used in automated SMT assembly, and what reel options are available?
Yes, the TFC-124-02-L-D-A-K is SMT-compatible and can be processed through standard convection reflow ovens at peak temperatures up to 260°C per JEDEC J-STD-020 profiles. Samtec offers this part in tape-and-reel packaging for pick-and-place automation at production volumes, with standard reel quantities supporting thousands of placements per reel to minimize changeover time on 8 mm or 12 mm carrier tape feeders.
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