TFC-121-02-F-D-A SAMTEC Connector (Other) In Stock
SAMTEC TFC-121-02-F-D-A is a 42-position Tiger Eye cost-effective dual-row terminal strip connector at 0.050 inch pitch for high-density PCB applications. Designed for reliable board-to-board interconnection with precision contacts and compact footprint supporting automated assembly. Available globally in engineering and production quantities with worldwide shipping.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 42
- Lifecycle
- ACTIVE
- Datasheet
- TFC-121-02-F-D-A Datasheet PDF
- Category
- Connector
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
Key Features
- 42-position dual-row Tiger Eye terminal strip at 0.050 inch (1.27 mm) pitch enabling cost-effective high-density board-to-board interconnection
- Cost-optimized SAMTEC Tiger Eye design balancing gold-quality contact performance with production-friendly pricing for volume applications
- Compact dual-row connector footprint supporting high channel-count signal and power routing in limited PCB space
- Compatible with standard SMT or through-hole assembly processes for flexible manufacturing integration across industrial and computing boards
Applications
The TFC-121-02-F-D-A serves embedded computing platforms, industrial automation controllers, and telecom line cards requiring 42-position dual-row board connections at 0.050 inch pitch in cost-sensitive designs. Its Tiger Eye construction provides reliable contact performance for data bus, control signal, and power rail interconnects on daughter cards and expansion modules. Server backplanes, test equipment interfaces, and network switching boards benefit from its high channel density and compact footprint.
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
Alternate & Equivalent Parts
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
How many positions and what pitch does the TFC-121-02-F-D-A terminal strip provide?
The TFC-121-02-F-D-A provides 42 positions in a dual-row configuration at 0.050 inch (1.27 mm) pitch, delivering 21 contacts per row. This high-density layout supports up to 42 independent signal or power channels in a compact connector footprint, making it well-suited for embedded computing, industrial I/O, and telecom applications where board space is at a premium.
What makes the Tiger Eye series cost-effective compared to premium SAMTEC connector families at the same pitch?
The Tiger Eye series, including TFC-121-02-F-D-A, is engineered with a simplified contact and housing design that reduces material and manufacturing costs versus premium SAMTEC families while maintaining reliable 0.050 inch pitch dual-row interconnect performance. Designed for applications requiring 42-pin connectivity with moderate mating cycle counts, it provides a cost-optimized solution for production volumes in embedded systems, industrial boards, and test fixtures where premium plating or exotic materials are not required.
Which board-to-board interconnect scenarios are best suited for the TFC-121-02-F-D-A?
The TFC-121-02-F-D-A is best suited for daughter card-to-motherboard, mezzanine card, and expansion board interconnects in embedded computing and industrial control systems. Its 42-position dual-row layout at 0.050 inch pitch can route multiple parallel data buses, control signals, and auxiliary power rails in a single compact connector, eliminating the need for multiple smaller connectors and simplifying PCB layout for server modules, network cards, and measurement equipment.
How does selecting the dual-row TFC-121-02-F-D-A over two single-row 21-position connectors affect PCB design?
Using TFC-121-02-F-D-A as a single 42-position dual-row connector instead of two separate 21-position single-row connectors reduces PCB land area by consolidating both rows into one 0.050 inch pitch footprint, saving board space and simplifying routing. It also reduces assembly steps from 2 connector placements to 1, lowering cost and improving alignment accuracy. The dual-row design at 1.27 mm pitch is standard for high-density embedded and telecom board interconnects.
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