TFC-120-02-LM-D SAMTEC Connector (Other) In Stock
The TFC-120-02-LM-D is a SAMTEC Tiger Eye 40-position dual-row board stacking connector with 0.050" (1.27 mm) pitch, featuring gold-plated mating contacts and phosphor bronze construction for reliable high-cycle board-to-board interconnects. Available in stock worldwide with competitive pricing for dense PCB stacking applications.
- Manufacturer
- SAMTEC
- Package
- Other
- Pin Count
- 40
- Lifecycle
- ACTIVE
- Datasheet
- TFC-120-02-LM-D Datasheet PDF
- Category
- Connector
- Price
- From $2.0940(MOQ 500)
- RoHS
- Compliant
- Lead Time
- 3–7 business days
- Shipping
- DHL Express · Worldwide
What are the key features of TFC-120-02-LM-D?
- 40-position dual-row board stacking connector at 0.050" (1.27 mm) pitch with gold (10 µin) mating contacts for low-contact-resistance, high-reliability connections
- Phosphor bronze contact material with tin/nickel barrier termination finish providing excellent spring retention and corrosion resistance over thousands of mating cycles
- Tiger Eye cost-effective design with JESD-609 e3 moisture sensitivity compliance enabling broad industrial and commercial PCB stacking applications
What is TFC-120-02-LM-D used for?
The TFC-120-02-LM-D is designed for high-density board stacking applications in networking equipment, industrial computers, and embedded computing modules where 40 signals must be routed between two PCBs at 0.050" pitch. Its gold-plated mating contacts and phosphor bronze construction ensure reliable performance in environments requiring repeated mating cycles, making it well suited for modular instrument systems, server blade interconnects, and plug-in expansion cards.
What are the specifications of TFC-120-02-LM-D?
| YTEOL | 8.65 |
| Connector Type | BOARD STACKING CONNECTOR |
| Contact Finish Mating | GOLD (10) |
| Contact Finish Termination | Tin (Sn) - with Nickel (Ni) barrier |
| Contact Gender | MALE |
| Contact Material | PHOSPHOR BRONZE |
| DIN Conformance | NO |
| Filter Feature | NO |
| IEC Conformance | NO |
| JESD-609 Code | e3 |
| MIL Conformance | NO |
| Mixed Contacts | NO |
| Mounting Style | STRAIGHT |
| Mounting Type | BOARD |
| Number Of Connectors | ONE |
| Number of Rows Loaded | 2 |
| Option | GENERAL PURPOSE |
| Rated Current (Signal) | 3.1A |
| Terminal Pitch | 1.27mm |
| Termination Type | SOLDER |
| Total Number of Contacts | 40 |
| Package | Other |
Compliance & Regulatory
| RoHS Status | Compliant |
| Lead-Free | Yes (Pb-Free) |
| ECCN | EAR99 |
| HTS Code | 8536.69.40.40 |
Where can I find the TFC-120-02-LM-D datasheet?
TFC-120-02-LM-D Datasheet DownloadOfficial datasheet from SAMTEC
What are equivalent replacements for TFC-120-02-LM-D?
No known alternates. Submit an RFQ and our team can suggest alternatives.
Frequently Asked Questions
What contact material and plating does the TFC-120-02-LM-D use for mating reliability over many cycles?
The TFC-120-02-LM-D uses phosphor bronze contact material with a gold-plated (10 µin minimum) mating surface and a tin with nickel barrier termination finish. The phosphor bronze provides excellent spring-back properties maintaining consistent contact force across the 40-position dual-row arrangement at 0.050" pitch, while the gold plating minimizes contact resistance and oxidation even after hundreds of mating cycles.
How does the 0.050" pitch of the TFC-120-02-LM-D benefit high-density PCB stacking designs versus a 0.100" pitch alternative?
At 0.050" (1.27 mm) pitch, the TFC-120-02-LM-D occupies approximately half the board length of an equivalent 40-position connector at 0.100" pitch. The dual-row arrangement routes 40 signals in a footprint roughly 25.4 mm long, compared to about 50.8 mm for a single-row 0.100" pitch header, allowing board stacking designs in compact embedded computing modules and networking blades to achieve higher signal density in the same PCB area.
Is the TFC-120-02-LM-D compliant with moisture sensitivity standards, and how does this affect storage and assembly?
The TFC-120-02-LM-D carries a JESD-609 code of e3, which corresponds to MSL 3 (Moisture Sensitivity Level 3) under IPC/JEDEC J-STD-020. This means the connector must be soldered within 168 hours after opening the moisture barrier bag at conditions not exceeding 30°C and 60% relative humidity. Proper dry storage at humidity levels below 10% RH extends the floor life and ensures solder joint quality on the tin-terminated through-hole pins.
For a modular expansion card system, how many signal lines can the TFC-120-02-LM-D support in a single connector instance?
The TFC-120-02-LM-D supports 40 signal lines per connector instance in its 2-row, 20-per-row configuration at 0.050" pitch. For a modular expansion card requiring more signals, multiple TFC-120-02-LM-D connectors can be used in parallel, or the 40-position count can accommodate a 32-bit data bus plus 8 control/address lines, making it practical for FPGA mezzanine cards and industrial I/O expansion modules.
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About SAMTEC
SAMTEC is a leading electronic component manufacturer. FindMyChip sources SAMTEC ICs directly from authorized China distributors, offering competitive pricing and reliable stock.
| Qty. | Unit Price | Ext. Price |
|---|---|---|
| 500+ | $4.2200 | $2110.00 |
| 1000+ | $3.7700 | $3770.00 |
| 2500+ | $2.9000 | $7250.00 |
| 5000+ | $2.0940 | $10470.00 |
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